Characterization of Interfacial Adhesion under Cyclic Loading

UT Austin PI: Rui Huang
CO-PIs: Kenneth M. Liechti
Funding Source: Semiconductor Research Corporation (SRC)
Award: $270K
Award Date: 1/22

The objective of this research is to develop novel experiments and models for characterizing the strength of interfacial adhesion under cyclic loading (mechanical and thermal cycles). The proposed research responds directly to the Packaging research needs outlined in Category 4: Metrology and Modeling, aiming to enable fundamental understanding of package performance and reliability and to help improve manufacturability.