Characterization of interfacial adhesion over small surface areas

UT Austin PI: Kenneth M. Liechti

CO-PIs: Rui Huang

Funding Source: Semiconductor Research Corporation

Award: $285K

Award Date: 01/01/2023 for 3 years

The objective of this research is to develop experiments and models for characterizing adhesion over the small surface areas that are encountered in wafer-bonded interconnects and other heterogeneous interfaces.