• UT Austin PI: Kenneth M. Liechti
  • CO-PIs: Rui Huang
  • Funding Source: Semiconductor Research Corporation
  • Award: $285K
  • Award Date: 1/1/23 for 3 years


The objective of this research is to develop experiments and models for characterizing adhesion over the small surface areas that are encountered in wafer-bonded interconnects and other heterogeneous interfaces.