June 16, 2010
Haixia Mei, an Engineering Mechanics graduate student advised by Dr. Rui Huang, has received the Best Paper Award at the Twelfth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2010) held in June of 2010. The paper, entitled “Initiation and Propagation of Interfacial Delamination in Integrated Thin-Film Structures”, is co-authored by Haixia Mei, Shravan Gowrishankar, Dr. Kenneth Liechti and Dr. Rui Huang. Funding for this work is provided by Semiconductor Research Corporation (SRC).
