Professor
Bettie Margaret Smith Professorship in Engineering
Department of Aerospace Engineering and Engineering Mechanics
University of Texas at Austin
Email: ruihuang@mail.utexas.edu
Phone: 1-512-471-7558
J.H. Seol, I. Jo, A.L. Moore, L. Lindsay, Z.H. Aitken, M.T. Pettes, X. Li, Z. Yao, R. Huang, D. Broido,
N. Mingo, R.S. Ruoff, and L. Shi, Two-dimensional phonon transport in supported graphene.
Science 328, 213-216 (2010). DOI: 10.1126/science.1184014.
H. Yin, R. Huang, K.D. Hobart, Z. Suo, T.S. Kuan, C.K. Inoki, S.R. Shieh, T.S. Duffy, F.J. Kub, J.C. Sturm,
Strain relaxation of SiGe islands on compliant oxide.
Journal of Applied Physics 91, 9716-9722 (2002).
Q. Lu and R. Huang, Mechanical Behavior of Monolayer Graphene by Continuum and Atomistic Modeling.
Chapter 14 in: Simulations in Nanobiotechnology
(Editor: K. Eom), CRC Press, 2011.
T. Jiang, C. Wu, P. Su, P. Chia, L. Li, H.-Y. Son, M.-S. Suh, N.-S. Kim, J. Im, R. Huang, P.S. Ho,
Effect of high temperature storage on the stress and reliability of 3D stacked chip.
Proc. IEEE 64th Electronic Components and Technology Conference (ECTC), pp. 1122-1127
(Orlando, FL, May 27-30, 2014).
DOI: 10.1109/ECTC.2014.6897430.
T. Jiang, C. Wu, J. Im, R. Huang, P.S. Ho,
Effect of microstructure on via extrusion profile and reliability implication for
copper through-silicon vias (TSVs) structures. Proc. 2014 IEEE International Interconnect Technology
Conference/Advanced Metallization Conference (IITC/AMC), pp. 377-380 (San Jose, CA, May 20-23, 2014).
DOI: 10.1109/IITC.2014.6831838.
T. Jiang, S.-K. Ryu, Q. Zhao, J. Im, P.S. Ho, R. Huang,
Thermomechanical characterization and modeling for TSV structures.
AIP Conf. Proc. 1601, 148-157 (2014).
DOI: 10.1063/1.4881348.
T. Jiang, S.-K. Ryu, J. Im, R. Huang and P.S. Ho,
Characterization of thermal stresses and plasticity in through-silicon via structures for
three-dimensional integration. AIP Conf. Proc. 1601, 55-66 (2014).
DOI: 10.1063/1.4881340.
B. Li, H. Huang, Q. Zhao, Z. Luo, J.-H. Im, P.S Ho, M.K. Kang, R. Huang, and M.W. Cresswel,
Mechanical Characterization of High Aspect Ratio Silicon Nanolines.
In: Mechanics of Nanoscale Materials, edited by C. Friesen, R.C. Cammarata, A. Hodge, O.L. Warren
(Mater. Res. Soc. Symp. Proc., vol. 1086E, Warrendale, PA, 2008), 1086-U05-07.
Y. Pang and R. Huang,
Influence of interfacial delamination on channel cracking of brittle thin films.
In: Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro-
and Nanoelectronics, edited by Q. Lin, E.T. Ryan, W-L. Wu, D.Y. Yoon (Mater. Res. Soc. Symp. Proc.
Vol. 990, Warrendale, PA), B06-04, 2007.
R. Huang, C.M. Stafford, B.D. Vogt, Wrinkling of ultrathin polymer films.
In: Mechanics of Nanoscale Materials and Devices,
edited by A. Misra, J.P. Sullivan, H. Huang, K. Lu, and S. Asif
(Mater. Res. Soc. Symp. Proc., vol. 924E, Warrendale, PA, 2006), 0924-Z04-10.