Suk-kyu Ryu, an aerospace engineering graduate student, received a best presentation award from Semiconductor Research Corporation (SRC) TECHCON for his paper entitled “Thermal Mechanical Reliability of Air Gap Interconnects", on Monday, September 14. Suk-kyu received a certificate and $100 honorarium. He is advised by Dr. Rui Huang of the UT ASE/EM department.

The research project has received funding from Tokyo Electron (TEL) and Semiconductor Research Corporation (SRC). Sponsored by SRC and its member companies, TECHCON is the technical conference that highlights the quality of the SRC-supported research, the excellence of the SRC students and faculty, and the magnitude of the collaborative research investment made by the semiconductor industry through SRC.

For more information about SRC and TECHCON visit