|
Rui Huang
Professor
Bettie Margaret Smith Professorship in Engineering
Department of Aerospace Engineering and Engineering Mechanics
University of Texas at Austin
Email: ruihuang@mail.utexas.edu
Phone: 1-512-471-7558
|
Research Topics:
- Time and Rate Dependent Fracture of Materials and Interfaces
- Nonlinear Mechanics of Hydrogels and Soft Materials
- Reliability in Advanced Interconnects and Packaging
- Nonlinear Mechanics of Graphene and 2D Materials
- Buckling of Nanostructures
- Wrinkling of Thin Films on Soft Substrates
- Surface Morphological Evolution and Self-Assembly of Quantum Dots
- Stress Relaxation and Interface Diffusion in Copper Interconnects
- Fracture in Thin-Film Structures
- Strain-Relaxed SiGe Islands on Oxides
- Deformation Mechanisms in Metallic Glasses
- Theory and Applications of Mechanical Resonators
Time and Rate Dependant Fracture of Materials and Interfaces
Collaborators: Chad Landis (UT) and Kenneth M. Liechti (UT)
Funding: NSF and SRC
Presentation slides:
Publications:
-
T. Yang, K.M. Liechti, R. Huang,
A multiscale cohesive zone model for rate-dependent fracture of interfaces.
J. Mech. Phys. Solids 145, 104142 (2020).
DOI
-
Y. Yu, C.M. Landis, R. Huang,
Poroelastic effects on steady state crack growth in polymer gels under plane stress.
Mechanics of Materials 143, 103320 (2020). DOI
-
Y. Yu, N. Bouklas, C.M. Landis, R. Huang,
Poroelastic effects on the time and rate dependent fracture of polymer gels.
J. Appl. Mech. 87, 031005 (2020).
DOI
-
C. Xu, T. Yang, Y. Kang, Q. Li, T. Xue, K.M. Liechti, R. Huang, W. Qiu,
Rate-dependent decohesion modes in
graphene sandwiched interfaces. Advanced Materials Interfaces, 1901217 (2019).
DOI
-
T. Yang, X. Yang, R. Huang, K.M. Liechti,
Rate-dependent traction-separation relations for a silicon/epoxy interface
informed by experiments and bond rupture kinetics.
J. Mech. Phys. Solids 131, 1-19 (2019).
DOI: 10.1016/j.jmps.2019.06.013.
- Y. Yu, N. Bouklas, C.M. Landis, R. Huang,
A Linear Poroelastic Analysis of Time-Dependent
Crack-Tip Fields in Polymer Gels. J. Appl. Mech. 85, no.111011 (2018).
DOI: 10.1115/1.4041040.
- Y. Yu, C.M. Landis, R. Huang, Steady-State Crack Growth in Polymer Gels:
A Linear Poroelastic Analysis. J. Mech. Phys. Solids 118, 15-39 (2018).
Nonlinear Mechanics of Hydrogels and Soft Materials
Collaborators: Chad Landis (UT) and K. Ravi-Chandar (UT)
Funding: National Science Foundation
Presentation slides:
Publications:
-
S. Chen, R. Huang, K. Ravi-Chandar, Linear and nonlinear poroelastic analysis
of swelling and drying behavior of gelatin-based hydrogels. International Journal of Solids and Structures 195, 43-56 (2020).
DOI
-
Y. Yu, C.M. Landis, R. Huang,
Poroelastic effects on steady state crack growth in polymer gels under plane stress.
Mechanics of Materials 143, 103320 (2020). DOI
-
Y. Yu, N. Bouklas, C.M. Landis, R. Huang,
Poroelastic effects on the time and rate dependent fracture of polymer gels.
J. Appl. Mech. 87, 031005 (2020).
DOI
- Y. Yu, N. Bouklas, C.M. Landis, R. Huang, A Linear Poroelastic Analysis of Time-Dependent
Crack-Tip Fields in Polymer Gels. J. Appl. Mech. 85, no.111011 (2018).
DOI: 10.1115/1.4041040.
- Y. Yu, C.M. Landis, R. Huang, Steady-State Crack Growth in Polymer Gels:
A Linear Poroelastic Analysis. J. Mech. Phys. Solids 118, 15-39 (2018).
-
Y. Yu, C.M. Landis, R. Huang, Salt-induced Swelling and Volume Phase Transition of Polyel
ectrolyte Gels.
Journal of Applied Mechanics 84, 051005 (2017).
DOI: 10.1115/1.4036113.
-
P. Wang, W. Gao, J. Wilkerson, K. M. Liechti and R. Huang,
Cavitation of water by volume-controlled stretching.
Extreme Mechanics Letters 11, 59-67 (2017).
DOI: 10.1016/j.eml.2016.12.004.
Preprint at arXiv:1609.07187.
-
Z. Wu, N. Bouklas, Y. Liu, R. Huang,
Onset of swell-induced surface instability of hydrogel layers with depth-wise graded material properties.
Mechanics of Materials 105, 138-147 (2017).
-
N. Bouklas, C.M. Landis, R. Huang,
Effect of solvent diffusion on crack-tip fields and driving force for
fracture of hydrogels. Journal of Applied Mechanics 82, 081007 (2015).
DOI: 10.1115/1.4030587.
-
N. Bouklas, C.M. Landis, R. Huang, A nonlinear, transient finite element method for coupled solvent diffusion
and large deformation of hydrogels. J. Mech. Phys. Solids 79, 21-43 (2015).
DOI: 10.1016/j.jmps.2015.03.004.
-
S. Chatterjee, C. McDonald, J. Niu, S. Velankar, P. Wang, R. Huang,
Wrinkling and folding of thin films by viscous stress. Soft Matter 11, 1814-1827 (2015).
DOI: 10.1039/C4SM02501F.
-
Z. Wu, J. Meng, Y. Liu, H. Li, R. Huang,
A state space method for surface instability of elastic layers with material properties varying in thickness
direction. Journal of Applied Mechanics 81, 081003 (2014).
-
V. Nayyar, K. Ravi-Chandar, R. Huang,
Stretch-induced wrinkling of polyethylene thin sheets: experiments and modeling.
International Journal of Solids and Structures 51, 1847-1858 (2014).
DOI: 10.1016/j.ijsolstr.2014.01.028
-
F. Weiss, S. Cai, Y. Hu, M. K. Kang, R. Huang, Z. Suo,
Creases and wrinkles on the surface of a swollen gel.
J. Applied Physics 114, 073507 (2013).
-
Z. Wu, N. Bouklas, R. Huang,
Swell-induced surface instability of hydrogel layers with material
properties varying in thickness direction. Int. J. Solids and Structures 50, 578-587 (2013).
DOI: 10.1016/j.ijsolstr.2012.10.022.
-
N. Bouklas and R. Huang,
Swelling kinetics of polymer gels: comparison of linear and nonlinear theories.
Soft Matter 8, 8194-8203 (2012).
DOI: 10.1039/C2SM25467K.
-
T. Lu, J. Huang, C. Jordi, G. Kovacs, R. Huang, D.R. Clarke, Z. Suo,
Dielectric elastomer actuators
under equi-biaxial forces, uniaxial forces, and uniaxial constraint of stiff fibers.
Soft Matter 8, 6167-6173 (2012).
DOI: 10.1039/c2sm25692d.
-
R. Huang and Z. Suo,
Electromechanical phase transition in dielectric elastomers.
Proc. Royal Soc. A 468, 1014-1040 (2012).
DOI: 10.1098/rspa.2011.0452.
-
V. Nayyar, K. Ravi-Chandar, R. Huang,
Stretch-induced stress patterns and wrinkles in hyperelastic thin sheets.
International Journal of Solids and Structures 48, 3471-3483 (2011).
DOI: 10.1016/j.ijsolstr.2011.09.004.
-
M.K. Kang and R. Huang, Swell-induced instability of substrate-attached
hydrogel lines. Int. J. Applied Mechanics 3, 219-233 (2011).
DOI: 10.1142/S1758825111000956.
-
M. Caldorera-Moore, M.K. Kang, Z. Moore, V. Singh, S.V. Sreenivasan, L. Shi, R. Huang, K. Roy,
Swelling behavior
of nanoscale shape- and size-specific hydrogel particles fabricated using imprint lithography.
Soft Matter 7, 2879-2887 (2011).
DOI: 10.1039/C0SM01185A.
-
M.K. Kang and R. Huang, Effect of surface tension on swell-induced
surface instability of substrate-confined hydrogel layers.
Soft Matter 6, 5736-5742 (2010).
DOI: 10.1039/c0sm00335b.
-
M.K. Kang and R. Huang, Swell induced surface instability
of confined hydrogel layers on substrates.
J. Mech. Phys. Solids 58, 1582-1598 (2010).
DOI: 10.1016/j.jmps.2010.07.008.
-
M.K. Kang and R. Huang, A Variational Approach and Finite Element Implementation for
Swelling of Polymeric Hydrogels under Geometric Constraints.
J. Appl. Mech. 77, 061004 (2010).
DOI: 10.1115/1.4001715.
Reliability in Advanced Interconnects and Packaging
Collaborators:
Kenneth M. Liechti (UT-AEEM)
and Paul S. Ho (UT-ME)
Funding: Semiconductor Research Cooperation (SRC) and Tokyo Electron
Presentation slides:
Publications:
-
C. Wu, R. Huang, K.M. Liechti,
Characterizing Interfacial Sliding of Through-Silicon-Via by Nano-indentation.
IEEE Transcations on Device and Materials Reliability 17, 355-363 (2017).
DOI: 10.1109/TDMR.2017.2681580.
-
T. Jiang, L. Spinella, J.-H. Im, R. Huang, P.S. Ho,
Processing Effect on Via Extrusion for TSVs in Three-Dimensional
Interconnects: A Comparative Study. IEEE Transcations on Device and Materials Reliability 16,
465-469 (2016).
-
C. Wu, S. Gowrishankar, R. Huang, K.M. Liechti, On determining mixed-mode
traction-separation relations for interfaces. Int. J. Fracture 202, 1-19 (2016).
DOI: 10.1007/s10704-016-0128-4.
-
T. Jiang, C. Wu, J. Im, R. Huang, P.S. Ho, Impact of grain structure and
material properties on via extrusion in 3D interconnects. J. Microelectronics and Electronic Packaging 12, 118-122 (2015).
DOI: 10.4071/imaps.456.
-
T. Jiang, J. Im, R. Huang, P.S. Ho,
Through-silicon via stress characteristics and reliability impact on 3D Integrated Circuits.
MRS Bulletin 40, 248-256 (2015).
-
T. Jiang, C. Wu, N. Tamura, M. Kunz, B. Kim, H.-Y. Son, M. Suh, J. Im, R. Huang, P.S. Ho,
Study of stresses and plasticity in through-silicon via structures for 3D interconnects
by x-ray micro-beam diffraction. IEEE Trans. on Device and Materials Reliability 14, 698-703 (2014).
DOI: 10.1109/TDMR.2014.2310705.
-
S.-K. Ryu, T. Jiang, J. Im, P.S. Ho, R. Huang,
Thermo-mechanical failure analysis of through-silicon via
interface using a shear-lag model with cohesive zone.
IEEE Trans. on Device and Materials Reliability 14, 318-326 (2014).
DOI: 10.1109/TDMR.2013.2261300.
-
S.-K. Ryu, J. Im, P.S. Ho, R. Huang,
A kinetic decomposition process for air-gap interconnects and induced deformation instability
of a low-k dielectric cap layer. J. Mechanical Science and Technology 28, 255-261 (2014).
-
T. Jiang, C. Wu, L. Spinella, J. Im, N. Tamura, M. Kunz, H.-Y. Son, B.G. Kim, R. Huang, P.S. Ho,
Plasticity mechanism for copper extrusion in through-silicon vias for three-dimensional interconnects.
Appl. Phys. Lett. 103, 211906 (2013).
-
T. Jiang, S.-K. Ryu, Q. Zhao, J. Im, R. Huang and P.S. Ho,
Measurement and Analysis of Thermal Stresses in 3D Integrated Structures Containing
Through-Silicon Vias. Microelectronics Reliability 53, 53-62 (2013).
DOI: 10.1016/j.microrel.2012.05.008.
"Highly Cited Research in Microelectronics Reliability".
-
S.-K. Ryu, K.-H. Lu, T. Jiang, J. Im, R. Huang, P.S. Ho,
Effect of Thermal Stresses on Carrier Mobility and Keep-out Zone around Through-Silicon Vias for 3-D Integration.
IEEE Trans. on Device and Materials Reliability 12, 255-262 (2012).
DOI: 10.1109/TDMR.2012.2194784.
Front cover.
-
S.-K. Ryu, Q. Zhao, M. Hecker, H. Y. Son, K. Y. Byun, J. Im, P.S. Ho, and R. Huang,
Micro-Raman Spectroscopy and Analysis of Near-Surface Stresses in Silicon around
Through-Silicon Vias for Three-Dimensional Interconnects.
J. Appl. Phys. 111, 063513 (2012).
-
S.-K. Ryu, T. Jiang, K.H. Lu, J. Im, H.-Y. Son, K.-Y. Byun, R. Huang, and P.S. Ho,
Characterization of thermal stresses in through-silicon vias for three-dimensional
interconnects by bending beam technique.
Applied Physics Letters 100, 041901 (2012).
-
K.H. Lu, S.-K. Ryu, Q. Zhao, K. Hummler, J. Im, R. Huang, P. S. Ho,
Temperature-dependent Thermal Stress Determination for Through-Silicon-Vias (TSVs) by Combining
Bending Beam Technique with Finite Element Analysis.
Proc. IEEE Electronic Components and Technology Conference (ECTC), 1475-1480 (Lake Buena Vista, FL, 2011).
DOI: 10.1109/ECTC.2011.5898705.
-
J. Mitra, M. Jung, S.-K. Ryu, R. Huang, S.-K. Lim, D. Z. Pan,
A fast simulation framework for full-chip thermo-mechanical stress and reliability analysis
of through-silicon-via based 3D ICs.
Proc. IEEE Electronic Components and Technology Conference (ECTC), 746-753 (Lake Buena Vista, FL, 2011).
DOI: 10.1109/ECTC.2011.5898596.
-
K.-H. Lu, S.-K. Ryu, J. Im, R. Huang, P. S. Ho,
Thermomechanical reliability of through-silicon vias in 3D interconnects.
Proc. 2011 IEEE International Reliability Physics Symposium (IRPS), 3D.1 (Monterey CA, 2011).
DOI: 10.1109/IRPS.2011.5784487.
-
S.-K. Ryu, K.-H. Lu, J. Im, R. Huang, P. S. Ho,
Stress-Induced Delamination Of Through Silicon Via Structures.
In: International Workshop on Stress Management for 3D ICs Using Through Silicon Vias.
AIP Conf. Proc. 1378, 153-167 (2011).
DOI: 10.1063/1.3615702.
-
S.-K. Ryu, K.-H. Lu, X. Zhang, J. Im, P.S. Ho, and R. Huang,
Impact of Near-Surface Thermal Stresses on Interfacial Reliability of Through-Silicon-Vias for 3-D Interconnects.
IEEE Trans. on Device and Materials Reliability 11, 35-43 (2011).
DOI: 10.1109/TDMR.2010.2068572.
-
H. Mei, S. Gowrishankar, K. M. Liechti, R. Huang,
Initiation and propagation of interfacial delamination in integrated thin-film structures.
Proc. 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
Las Vegas, NV, June 2010.
DOI: 10.1109/ITHERM.2010.5501290.
-
K.H. Lu, S.-K. Ryu, Q. Zhao, X. Zhang, J. Im, R. Huang, P. S. Ho,
Thermal stress induced delamination of through silicon vias in 3-D interconnects.
Proc. IEEE Electronic Components and Technology Conference (ECTC), 40-45 (Las Vegas, NV, 2010).
DOI: 10.1109/ECTC.2010.5490883.
-
S.-K. Ryu, K.-H. Lu, X. Zhang, J. Im, P. S. Ho, R. Huang,
Thermomechanical Reliability Challenges For 3D Interconnects With Through-Silicon Vias.
In: 11th International Workshop on Stress-Induced Phenomena in Metallization.
AIP Conf. Proc. 1300, 189-201 (2010).
doi: 10.1063/1.3527126.
-
K.H. Lu, X. Zhang, S.-K. Ryu, J. Im, R. Huang, P. S. Ho,
Thermo-mechanical reliability of 3-D ICs containing through silicon vias.
Proc. IEEE Electronic Components and Technology Conference (ECTC), 630-634 (San Diego, CA, 2009).
DOI: 10.1109/ECTC.2009.5074079.
-
K.H. Lu, X. Zhang, S.-K. Ryu, R. Huang, P. S. Ho,
Thermal Stresses Analysis of 3-D Interconnect.
In: 10th International Workshop on Stress-Induced Phenomena in Metallization.
AIP Conf. Proc. 1143, 224-230 (2009).
doi: 10.1063/1.3169263.
-
X. Zhang, R. S. Smith, R. Huang, P. S. Ho,
Chip-Package Interaction and Crackstop Study for Cu/Ultra low-k Interconnects.
In: 10th International Workshop on Stress-Induced Phenomena in Metallization.
AIP Conf. Proc. 1143, 197-203 (2009).
doi: 10.1063/1.3169259.
-
X. Zhang, S.-K. Ryu, R. Huang, P.S. Ho, J. Liu, D. Toma, Mechanical stability of
air-gap interconnects. Future Fab 27, 81-87 (October 2008).
-
X. Zhang, S.-K. Ryu, R. Huang, P. S. Ho, J. Liu, D. Toma,
Impact of process induced stresses and chip-packaging interaction on reliability of air-gap interconnects.
Proc. 2008 IEEE International Interconnect Technology Conference (IITC), 135-137 (Burlingame, CA, 2008).
DOI: 10.1109/IITC.2008.4546947.
-
X. Zhang, S. H. Im, R. Huang, P. S. Ho,
Chip-Packaging Interaction and Reliability Impact on Cu/Low-k Interconnects.
Chapter 2, Integrated Interconnect Technologies for 3D Nanoelectronic Systems (Editors: M. Bakir and J. Meindl),
Artech House, Norwood, MA, 2008.
-
H. Mei, Y. Pang, S. H. Im, R. Huang,
Fracture, delamination, and buckling of elastic thin films on compliant substrates.
Proc. 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
pp. 762-769, Orlando, FL, May 2008.
DOI: 10.1109/ITHERM.2008.4544345.
Nonlinear Mechanics of Graphene and 2D Materials
Collaborators:
Kenneth M. Liechti (UT-Austin)
Funding: National Science Foundation
Presentation slides:
Publications:
-
Z. Dai, N. Lu, K.M. Liechti, R. Huang,
Mechanics at the Interfaces of 2D Materials: Challenges and Opportunities.
Current Opinion in Solid State and Materials Science 24, 100837 (2020).
DOI
-
R. Huang, Bending with slip. Nature Materials 19, 259-260 (2020).
-
C. Xu, T. Yang, Y. Kang, Q. Li, T. Xue, K.M. Liechti, R. Huang, W. Qiu,
Rate-dependent decohesion modes in
graphene sandwiched interfaces. Advanced Materials Interfaces, 1901217 (2019).
DOI
-
G. Wang, Z. Dai, J. Xiao, S. Feng, C. Weng, L. Liu, Z. Xu, R. Huang, Z. Zhang,
Bending of multilayer van der Waals materials.
Phys. Rev. Lett. 123, 116101 (2019).
DOI: 10.1103/PhysRevLett.123.116101.
MRS
News.
-
B. Smith, L. Lindsay, J. Kim, E. Ou, R. Huang, L. Shi,
Phonon Interaction with Ripples and Defects in Thin Layered Molybdenum Disulfide.
Appl. Phys. Lett. 114, 221902 (2019).
DOI: 10.1063/1.5099103.
-
D. A. Sanchez, Z. Dai, P. Wang, A. Cantu-Chaveza, C. J. Brennan, R. Huang, N. Lu,
Mechanics of Spontaneously Formed Nanoblisters Trapped by Transferred 2D Crystals.
PNAS, 115, 7884-7889 (2018).
DOI: 10.1073/pnas.1801551115.
-
G. Wang, Z. Dai, Y. Wang, P. Tan, L. Liu, Z. Xu, Y. Wei, R. Huang, Z. Zhang,
Measuring Interlayer Shear Stress in Bilayer Graphene.
Phys. Rev. Lett. 119, 036101 (2017).
DOI: 10.1103/PhysRevLett.119.036101.
Featured in Physics Focus:
Graphene Sliding on Graphene.
Editors' Suggestion: Highlights.
-
F. Ahmadpoor, P. Wang, R. Huang, P. Sharma,
Thermal Fluctuations and Effective Bending Stiffness of Elastic
Thin Sheets and Graphene: A Nonlinear Analysis. J. Mech. Phys. Solids 107, 294-319 (2017).
DOI: 10.1016/j.jmps.2017.07.11.
-
D. Akinwande, C.J. Brennan, J.S. Bunch, P. Egberts, J.R. Felts, H. Gao, R. Huang, J.-S. Kim, T. Li, Y. Li,
K.M. Liechti, N. Lu, H.S. Park, E.J. Reed, P. Wang, B.I. Yakobson, T. Zhang, Y.-W. Zhang, Y. Zhou, Y. Zhu,
A Review on Mechanics and Mechanical Properties of 2D Materials - Graphene and Beyond.
Extreme Mechanics Letters 13, 42-72 (2017). DOI: 10.1016/j.eml.2017.01.008.
Preprint at arXiv:1611.01555.
-
S.R. Na, X. Wang, R.D. Piner, R. Huang, C.G. Willson, K. M. Liechti,
Cracking of Polycrystalline Graphene on Copper Under Tension. ACS Nano 10, 9616-9625 (2016).
DOI: 10.1021/acsnano.6b05101.
-
P. Wang, K.M. Liechti, R. Huang, Snap transitions of pressurized graphene blisters.
Journal of Applied Mechanics 83, 071002 (2016).
DOI: 10.1115/1.4033305.
-
P. Wang, W. Gao, R. Huang, Entropic effects of thermal rippling on van der Waals interactions
between monolayer graphene and a rigid substrate. J. Applied Physics 119, 074305 (2016).
Preprint at arXiv:1511.02914.
-
Z. Cao, L. Tao, D. Akinwande, R. Huang, K.M. Liechti,
Mixed-mode traction-separation relations between graphene and copper by blister tests. Int. J. Solids and Structures 84, 147-159 (2016).
DOI: 10.1016/j.ijsolstr.2016.01.023.
-
Z. Cao, L. Tao, D. Akinwande, R. Huang, K.M. Liechti,
Mixed-mode interactions between graphene and substrates by blister tests.
Journal of Applied Mechanics 82, 081008 (2015).
DOI: 10.1115/1.4030591.
-
W. Gao, K.M. Liechti, R. Huang, Wet adhesion of graphene. Extreme Mechanics Letters 3, 130-140 (2015).
DOI: 10.1016/j.eml.2015.04.003.
-
S.R. Na, J.W. Suk, L. Tao, D. Akinwande, R.S. Ruoff, R. Huang, K. M. Liechti,
Selective Mechanical Transfer of Graphene from Seed Copper Foil Using
Rate Effects. ACS Nano 9, 1325-1335 (2015).
DOI: 10.1021/nn505178g.
-
S.R. Na, J.W. Suk, R.S. Ruoff, R. Huang, K. M. Liechti,
Ultra Long-Range Interactions between Large Area Graphene and Silicon.
ACS Nano 8, 11234-11242 (2014). DOI: 10.1021/nn503624f.
-
W. Gao, P. Xiao, G. Henkelman, K.M. Liechti, R. Huang, Interfacial adhesion between graphene and
silicon dioxide by density functional theory with van der Waals corrections.
J. Phys. D: Appl. Phys. 47, 255301 (2014).
arXiv:1403.3751.
-
W. Gao and R. Huang, Thermomechanics of monolayer graphene:
Rippling, thermal expansion and elasticity.
Journal of the Mechanics and Physics of Solids 66, 42-58 (2014).
DOI: 10.1016/j.jmps.2014.01.011.
-
Z. Cao, P. Wang, W. Gao, L. Tao, J.W. Suk, R.S. Ruoff, D. Akinwande, R. Huang, K.M. Liechti,
A blister test for interfacial adhesion of large-scale transferred graphene.
Carbon 69, 390-400 (2014) .
DOI: 10.1016/j.carbon.2013.12.041.
-
T. Jiang, R. Huang, Y. Zhu,
Interfacial Sliding and Buckling of Monolayer Graphene on a Stretchable Substrate. Advanced Functional Materials 24, 396-402 (2014).
Supporting Information.
DOI: 10.1002/adfm.201301999.
-
P. Wang, W. Gao, Z. Cao, K.M. Liechti, R. Huang, Numerical analysis of circular graphene bubbles.
J. Applied Mechanics 80, 040905 (2013).
doi:10.1115/1.4024169.
-
K. Yue, W. Gao, R. Huang, K.M. Liechti,
Analytical methods for the mechanics of graphene bubbles.
J. Appl. Phys. 112, 083512 (2012).
-
W. Gao and R. Huang,
Effect of surface roughness on adhesion of graphene membranes.
J. Phys. D: Appl. Phys. 44, 452001 (2011).
-
R. Huang,
Graphene: Show of adhesive strength (news and views).
Nature Nanotechnology 6, 537-538 (2011).
-
Q. Lu and R. Huang, Mechanical Behavior of Monolayer Graphene by Continuum and Atomistic Modeling.
Chapter 14 in: Simulations in Nanobiotechnology
(Editor: K. Eom), CRC Press, 2011.
-
Q. Lu, W. Gao and R. Huang,
Atomistic simulation and continuum modeling of graphene nanoribbons under uniaxial tension.
Modelling and Simulation in Materials Science and Engineering 19, 054006 (2011).
Posted online at arXiv:1007.3298.
-
Q. Lu and R. Huang, Nonlinear Mechanical Properties of Graphene Nanoribbons,
MRS Proceedings, vol. 1284, mrsf10-1284-c14-02 (2011). DOI: 10.1557/opl.2011.226.
-
Z.H. Aitken and R. Huang, Effects of mismatch strain and
substrate surface corrugation on morphology of supported monolayer graphene. J. Appl. Phys. 107, 123531 (2010). Posted online at arXiv:1003.0853.
-
J.H. Seol, I. Jo, A.L. Moore, L. Lindsay, Z.H. Aitken, M.T. Pettes, X. Li, Z. Yao, R. Huang, D. Broido,
N. Mingo, R.S. Ruoff, and L. Shi, Two-dimensional phonon transport in supported graphene.
Science 328, 213-216 (2010). DOI: 10.1126/science.1184014.
-
Q. Lu and R. Huang,
Excess energy and deformation along free edges of graphene nanoribbons.
Physical Review B 81, 155410 (2010).
Preprint posted online at arXiv:0910.0912, October 2009.
-
Q. Lu and R. Huang, Nonlinear mechanics of single-atomic-layer
graphene sheets. Int. J. Applied Mechanics 1, 443-467 (2009).
-
Q. Lu, M. Arroyo, R. Huang, Elastic bending modulus of monolayer graphene.
J. Phys. D: Appl. Phys. 42, 102002 (2009). Posted online at arXiv:0901.4370v1.
-
J. Zhou and R. Huang,
Internal lattice relaxation of single-layer graphene under in-plane deformation.
Journal of the Mechanics and Physics of Solids 56, 1609-1623 (2008).
Buckling of Nanostructures
Collaborators: Paul S. Ho (UT-Austin)
Funding: National Science Foundation
Publications:
-
B. Li, Q. Zhao, H. Huang, Z. Luo, M.K. Kang, J.-H. Im, R. Allen, M.W. Cresswel, R. Huang, and P.S Ho,
Indentation of Single-Crystal Silicon Nanolines: Buckling and Contact Friction
at Nanoscales. J. Applied Physics 105, 073510 (2009).
-
H. Huang, B. Li, Q. Zhao, Z. Luo, J. Im, M. K. Kang, R. A. Allen, M. W. Cresswell, R. Huang, P. S. Ho,
Nanoindentation of Si Nanostructures: Buckling and Friction at Nanoscales.
In: 10th International Workshop on Stress-Induced Phenomena in Metallization.
AIP Conf. Proc. 1143, 204-212 (2009). doi: 10.1063/1.3169260.
-
B. Li, H. Huang, Q. Zhao, Z. Luo, J.-H. Im, P.S Ho, M.K. Kang, R. Huang, and M.W. Cresswel,
Mechanical Characterization of High Aspect Ratio Silicon Nanolines.
In: Mechanics of Nanoscale Materials, edited by C. Friesen, R.C. Cammarata, A. Hodge, O.L. Warren
(Mater. Res. Soc. Symp. Proc., vol. 1086E, Warrendale, PA, 2008), 1086-U05-07.
-
M. K. Kang, B. Li, P.S. Ho, R. Huang,
Buckling of Single-Crystal Silicon Nanolines under Indentation.
Journal of Nanomaterials, Vol. 2008, Article ID 132728 (11 pages), April 2008. DOI: 10.1155/2008/132728.
-
B. Li, M. K. Kang, K. Lu, R. Huang, P. S. Ho, R. A. Allen, and M. W. Cresswell,
Fabrication and Characterization of Patterned Single-Crystal Silicon Nanolines.
Nano Letters 8, 92 -98 (2008).
Wrinkling of Thin Films on Soft Substrates
Collaborators: C.M. Stafford (NIST), Z. Suo (Harvard Univ.)
Funding: National Science Foundation and DARPA
Presentation slides:
Publications:
-
S. Chatterjee, C. McDonald, J. Niu, S. Velankar, P. Wang, R. Huang,
Wrinkling and folding of thin films by viscous stress. Soft Matter 11, 1814-1827 (2015).
DOI: 10.1039/C4SM02501F.
-
K. Pan, Y. Ni, L. He, R. Huang,
Nonlinear analysis of compressed elastic thin films on elastic
substrates: from wrinkling to buckle-delamination.
International Journal of Solids and Structures 51, 3715-3726 (2014).
DOI: 10.1016/j.ijsolstr.2014.07.005.
-
J.-H. Lee, H.W. Ro, R. Huang, P. Lemaillet, T.A. Germer, C.L. Soles, C.M. Stafford,
Anisotropic, Hierarchical Surface Patterns via Surface Wrinkling of Nanoimprinted Polymer Films.
Nano Letters 12, 5995-5999 (2012).
DOI: 10.1021/nl303512d.
-
C. Guo, V. Nayyar, Z. Zhang, Y. Chen, J. Miao, R. Huang and Q. Liu,
Path-guided wrinkling of nanoscale metal films.
Advanced Materials 24, 3010-3014 (2012).
DOI: 10.1002/adma.201200540.
Supporting Information and Back Cover.
-
J. Li, Y. An, R. Huang, H. Jiang, T. Xie,
Unique aspects of a shape memory polymer as the substrate for surface wrinkling.
ACS Applied Materials and Interfaces 4, 598-603 (2012).
DOI: 10.1021/am201727a
-
H. Mei, C.M. Landis, R. Huang,
Concomitant wrinkling and buckle-delamination of elastic thin films on compliant substrates.
Mechanics of Materials 43, 627-642 (2011).
DOI: 10.1016/j.mechmat.2011.08.003.
-
E.P. Chan, K.A. Page, S.H. Im, D.L. Patton, R. Huang, C.M. Stafford,
Viscoelastic properties of confined
polymer films measured via thermal wrinkling. Soft Matter 5, 4638-4641 (2009).
-
S. H. Im and R. Huang,
Wrinkle Patterns of Anisotropic Crystal Films on Viscoelastic Substrates.
J. Mech. Phys. Solids 56, 3315-3330 (2008).
doi: 10.1016/j.jmps.2008.09.011.
-
H. Mei, J.Y. Chung, H.-H. Yu, C.M. Stafford, and R. Huang,
Buckling modes of elastic thin films on elastic substrates.
Applied Physics Letters 90, 151902 (2007).
-
R. Huang, C.M. Stafford, B.D. Vogt, Effect of surface properties on wrinkling
of ultrathin films. J. Aerospace Engineering 20, 38-44 (2007).
- R. Huang, C.M. Stafford, B.D. Vogt, Wrinkling of ultrathin polymer films.
In: Mechanics of Nanoscale Materials and Devices,
edited by A. Misra, J.P. Sullivan, H. Huang, K. Lu, and S. Asif
(Mater. Res. Soc. Symp. Proc., vol. 924E, Warrendale, PA, 2006), 0924-Z04-10.
-
R. Huang and S.H. Im,
Dynamics of wrinkle growth and coarsening in stressed thin films.
Physical Review E 74, 026214 (2006).
-
C.M. Stafford, B.D. Vogt, C. Harrison, D. Julthongpiput, R. Huang,
Elastic Moduli of Ultrathin Amorphous Polymer Films. Macromolecules 39, 5095-5099 (2006).
-
R. Huang, Electrically induced surface instability of a conductive thin film
on a dielectric substrate. Applied Physics Letters 87, 151911 (2005).
-
S.H. Im and R. Huang, Evolution of wrinkles in elastic-viscoelastic
bilayer thin films. J. Applied Mechanics 72, 955-961 (2005).
-
R. Huang, Kinetic wrinkling of an elastic film on a viscoelastic substrate.
Journal of the Mechanics and Physics of Solids 53, 63-89 (2005).
-
S.H. Im and R. Huang,
Morphological instability and kinetics of an elastic film on a viscoelastic layer.
Proceedings of IUTAM Symposium on Size Effects on Material and Structure Behavior
at Micron- and Nano-Scales (Eds. Q.P. Sun and P. Tong, Hong Kong, 31 May - 4 June, 2004),
Springer 2006, pp. 41-50.
-
S.H. Im and R. Huang, Ratcheting-induced wrinkling of an elastic film
on a metal layer under cyclic temperatures.
Acta Mater 52, 3707-3719 (2004).
-
R. Huang and Z. Suo,
Very thin solid-on-liquid structures: the interplay of flexural rigidity, membrane force,
and interfacial force.
Thin Solid Films 429, 273-281 (2003).
- R. Huang and Z. Suo, Morphological instability of solid-on-liquid
thin film structures. MRS Symposium Proceedings, vol. 749, 121-126 (2002).
-
R. Huang and Z. Suo,
Instability of a compressed elastic film on a viscous layer.
International Journal of Solids and Structures 39, 1791-1802 (2002).
-
R. Huang and Z. Suo,
Wrinkling of a compressed elastic film on a viscous layer.
Journal of Applied Physics 91, 1135-1142 (2002).
Surface Morphological Evolution and Self-Assembly of Quantum Dots
Collaborators: Sanjay Banerjee (UT Austin)
Funding: Department of Energy
Publications:
-
Y. Pang and R. Huang,
Effect of Elastic Anisotropy on Surface Pattern Evolution of Epitaxial Thin Films.
Int. J. Solids and Structures 46, 2822-2833 (2009).
- Y. Pang and R. Huang, Bifurcation of Surface Pattern in
Epitaxial Thin Films under Anisotropic Stresses. J. Applied Physics 101, 023519 (2007).
- Y. Pang and R. Huang, Pattern Evolution of Self-Assembled Quantum Dots
Under Biaxial Stresses. In: Nanomanufacturing, edited by F. Stellacci, J.W. Perry, G.S. Herman,
and R.N. Das (Mater. Res. Soc. Symp. Proc., vol. 921E, Warrendale, PA, 2006), 0921-T07-08.
-
Y. Pang and R. Huang,
Nonlinear effect of stress and wetting on surface evolution in epitaxial thin films.
Physical Review B 74, 075413 (2006).
-
H. Liu and R. Huang, Effect of a cap layer on morphological stability
of a strained epitaxial film. J. Applied Physics 97, 113537 (2005).
Stress Relaxation and Interface Diffusion in Copper Interconnects
Collaborators: Paul S. Ho (UT Austin) and Jun He (Intel)
Funding: Advanced Technology Program of Texas Higher Education Coordinating Board and Intel Corporation
Publications:
- H. Mei, J.H. An, R. Huang, and P.J. Ferreira, Finite element modeling of
stress variation in multilayer thin-film specimens for in-situ transmission electron microscopy experiments.
Journal of Materials Research 22, 2737-2741 (2007).
-
D.W. Gan, P.S. Ho, Y. Pang, R. Huang, J. Leu, J. Maiz, T. Scherban,
Effect of passivation on stress relaxation in electroplated copper films.
J. Materials Research 21, 1512-1518 (2006).
-
D.W. Gan, R. Huang, P.S. Ho, J. Leu, J. Maiz, T. Scherban,
Effects of passivation layer on stress relaxation and mass transport in electroplated Cu films.
Proceedings of the 7th International Workshop on Stress-Induced Phenomena in Metallization,
Austin, Texas, 14-16 June 2004. AIP Conference Proceedings 741, 256-267 (2004).
-
R. Huang, D.W. Gan, P.S. Ho, Isothermal stress relaxation in electroplated
Cu films. Part II: Kinetic modeling.
J. Applied Physics 97, 103532 (2005).
-
D.W. Gan, R. Huang, P.S. Ho, J. Leu, J. Maiz, T. Scherban,
Isothermal stress relaxation in electroplated
Cu films. Part I: Mass transport measurements.
J. Applied Physics 97, 103531 (2005).
Fracture in Thin-Film Structures
Collaborators: Z. Suo (Harvard Univ.), J.H. Prevost (Princeton Univ.)
Funding: National Science Foundation
Presentation slides:
Publications:
-
C. Wu, S. Gowrishankar, R. Huang, K.M. Liechti, On determining mixed-mode
traction-separation relations for interfaces. Int. J. Fracture 202, 1-19 (2016).
DOI: 10.1007/s10704-016-0128-4.
-
S. Gowrishankar, H. Mei, K.M. Liechti and R. Huang,
A comparison of direct and iterative methods for determining traction-separation relations.
International Journal of Fracture 177, 109-128 (2012).
DOI: 10.1007/s10704-012-9758-3.
-
H. Mei, Y. Pang, and R. Huang,
Influence of interfacial delamination on channel cracking of elastic thin films.
International Journal of Fracture 148, 331-342 (2007).
-
Y. Pang and R. Huang,
Influence of interfacial delamination on channel cracking of brittle thin films.
In: Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro-
and Nanoelectronics, edited by Q. Lin, E.T. Ryan, W-L. Wu, D.Y. Yoon (Mater. Res. Soc. Symp. Proc.
Vol. 990, Warrendale, PA), B06-04, 2007.
-
J. Liang, R. Huang, J.H. Prevost, and Z. Suo,
Thin film cracking modulated by underlayer creep. Experimental Mechanics,
43, 269-279 (2003).
-
R. Huang, N. Sukumar, J.H. Prevost,
Modeling quasi-static crack growth with the extended finite element method
-Part II: Numerical Applications.
International Journal of Solids and Structures 40, 7539-7552 (2003).
-
R. Huang, J.H. Prevost, Z.Y. Huang, and Z. Suo,
Channel-cracking of thin films with the extended finite element method.
Engineering Fracture Mechanics 70, 2513-2526 (2003).
-
J. Liang, R. Huang, J.H. Prevost, and Z. Suo,
Evolving crack patterns in thin films with the extended finite element method.
International Journal of Solids and Structures 40, 2343-2354 (2003).
-
R. Huang, J.H. Prevost, and Z. Suo, Loss of constraint on fracture
in thin film structures due to creep. Acta Materialia 50, 4137-4148 (2002).
Strain-Relaxed SiGe Islands on Oxides
Collaborators: Z. Suo, J.C. Sturm, K.D. Hobart, H. Yin
Funding: National Science Foundation and DARPA
Publications:
-
H. Yin, R. Huang, K.D. Hobart, J. Liang, Z. Suo, S.R. Shieh, T.S. Duffy, F.J. Kub, J.C. Sturm,
Buckling suppression of SiGe islands on compliant substrates.
Journal of Applied Physics 94, 6875-6882 (2003).
-
R. Huang and Z. Suo,
Very thin solid-on-liquid structures: the interplay of flexural rigidity, membrane force,
and interfacial force.
Thin Solid Films 429, 273-281 (2003).
- R. Huang, Z. Suo, Morphological instability of solid-on-liquid
thin film structures. MRS Symposium Proceedings, vol. 749, 121-126 (2002).
-
R. Huang, H. Yin, J. Liang, J.C. Sturm, K.D. Hobart, Z. Suo,
Mechanics of relaxing SiGe islands on a viscous glass.
Acta Mechanica Sinica 18, 441-456 (2002).
-
H. Yin, R. Huang, K.D. Hobart, Z. Suo, T.S. Kuan, C.K. Inoki, S.R. Shieh, T.S. Duffy, F.J. Kub, J.C. Sturm,
Strain relaxation of SiGe islands on compliant oxide.
Journal of Applied Physics 91, 9716-9722 (2002).
-
J. Liang, R. Huang, H. Yin, J. C. Sturm, K. D. Hobart, and Z. Suo,
Relaxation of compressed elastic islands on a viscous layer.
Acta Materialia 50, 2933-2944 (2002).
-
R. Huang and Z. Suo,
Instability of a compressed elastic film on a viscous layer.
International Journal of Solids and Structures 39, 1791-1802 (2002).
-
R. Huang and Z. Suo,
Wrinkling of a compressed elastic film on a viscous layer.
Journal of Applied Physics 91, 1135-1142 (2002).
-
R. Huang, H. Yin, J. Liang, K. D. Hobart, J. C. Sturm, and Z. Suo,
Relaxation of a strained elastic film on a viscous layer.
MRS Symposium Proceedings, vol. 695, 115-120 (2001).
Deformation Mechanisms in Metallic Glasses
Collaborators: Z. Suo, J.H. Prevost, W.D. Nix
Funding: National Science Foundation
Publications:
Theory and Applications of Mechanical Resonators
"Vibrations of Piezoelectric Crystal Plates with Thickness-Graded Material Properties", PhD thesis,
Princeton University, January 2001.
Advisor: Peter C. Y. Lee
Collaborators: Jiun-Der Yu, Wen-Sen Lin, W.H. Shih, T. Knowles
Funding: U.S. Army Research Office
Publications:
-
M. K. Kang, R. Huang, T. Knowles,
Energy-Trapping Torsional-Mode Resonators for Liquid Sensing.
Proc. 2006 IEEE International Frequency Control Symposium and Exposition, pp. 133-138, Miami, FL, June 2006.
DOI: 10.1109/FREQ.2006.275365.
-
M. K. Kang, R. Huang, T. Knowles,
Trapped Torsional Vibrations in Elastic Plates.
Proc. 2006 IEEE International Frequency Control Symposium and Exposition, pp. 40-47, Miami, FL, June 2006.
DOI: 10.1109/FREQ.2006.275349.
-
T. Knowles, M.K. Kang, R. Huang, Trapped torsional vibrations
in elastic plates. Applied Physics Letters 87, 201911 (2005).
-
M.K. Kang, R. Huang, T. Knowles, Torsional vibrations
of circular elastic plates with thickness steps. IEEE Trans. Ultrasonics, Ferroelectrics and Frequency Control,
vol. 53, 349-359 (2006).
-
R. Huang, P.C.Y. Lee, W.S. Lin and J.D. Yu,
Extensional, thickness-stretch, and symmetric thickness-shear vibrations of piezoelectric ceramic disks.
IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control 49, 1507-1515 (2002).
-
P.C. Y. Lee and R. Huang,
Mechanical effects of electrodes on the vibrations of quartz crystal plates.
IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control 49, 612-625 (2002).
-
P.C.Y. Lee and R. Huang,
Effects of a liquid layer on thickness-shear vibrations of rectangular AT-cut quartz plates.
IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control 49, 604-611 (2002).
-
P.C.Y. Lee, R. Huang, X. Li, and W. H. Shih,
Vibrations and static responses of asymmetric bimorph disks of piezoelectric ceramics.
IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control 47, 706-715 (2000).