Rui Huang's portrait

Rui Huang

Professor
Aerospace Engineering and Engineering Mechanics
University of Texas at Austin
Email: ruihuang@mail.utexas.edu
Phone: 1-512-471-7558

Journal Publications:
  1. G. Wang, Z. Dai, Y. Wang, P. Tan, L. Liu, Z. Xu, Y. Wei, R. Huang, Z. Zhang, Measuring Interlayer Shear Stress in Bilayer Graphene. Phys. Rev. Lett. 119, 036101 (2017). DOI: 10.1103/PhysRevLett.119.036101. Featured in Physics Focus: Graphene Sliding on Graphene. Editors' Suggestion: Highlights.
  2. F. Ahmadpoor, P. Wang, R. Huang, P. Sharma, Thermal Fluctuations and Effective Bending Stiffness of Elastic Thin Sheets and Graphene: A Nonlinear Analysis. J. Mech. Phys. Solids 107, 294-319 (2017). DOI: 10.1016/j.jmps.2017.07.11.
  3. Z. Zhou, C. Yang, Y. Su, R. Huang, X. Lin, Electromechanical coupling in piezoelectric nanobeams due to flexoelectric effect. Smart Materials and Structures 26, 095025 (2017). link
  4. C. Wu, R. Huang, K.M. Liechti, Characterizing Interfacial Sliding of Through-Silicon-Via by Nano-indentation. IEEE Transcations on Device and Materials Reliability 17, 355-363 (2017). DOI: 10.1109/TDMR.2017.2681580.
  5. Y. Yu, C.M. Landis, R. Huang, Salt-induced Swelling and Volume Phase Transition of Polyel ectrolyte Gels. Journal of Applied Mechanics 84, 051005 (2017). DOI: 10.1115/1.4036113.
  6. D. Akinwande, C.J. Brennan, J.S. Bunch, P. Egberts, J.R. Felts, H. Gao, R. Huang, J.-S. Kim, T. Li, Y. Li, K.M. Liechti, N. Lu, H.S. Park, E.J. Reed, P. Wang, B.I. Yakobson, T. Zhang, Y.-W. Zhang, Y. Zhou, Y. Zhu, A Review on Mechanics and Mechanical Properties of 2D Materials - Graphene and Beyond. Extreme Mechanics Letters 13, 42-72 (2017). DOI: 10.1016/j.eml.2017.01.008. Preprint at arXiv:1611.01555.
  7. P. Wang, W. Gao, J. Wilkerson, K. M. Liechti and R. Huang, Cavitation of water by volume-controlled stretching. Extreme Mechanics Letters 11, 59-67 (2017). DOI: 10.1016/j.eml.2016.12.004. Preprint at arXiv:1609.07187.
  8. Z. Wu, N. Bouklas, Y. Liu, R. Huang, Onset of swell-induced surface instability of hydrogel layers with depth-wise graded material properties. Mechanics of Materials 105, 138-147 (2017).
  9. S.R. Na, X. Wang, R.D. Piner, R. Huang, C.G. Willson, K. M. Liechti, Cracking of Polycrystalline Graphene on Copper Under Tension. ACS Nano 10, 9616-9625 (2016). DOI: 10.1021/acsnano.6b05101.
  10. T. Jiang, L. Spinella, J.-H. Im, R. Huang, P.S. Ho, Processing Effect on Via Extrusion for TSVs in Three-Dimensional Interconnects: A Comparative Study. IEEE Transcations on Device and Materials Reliability 16, 465-469 (2016).
  11. C. Wu, S. Gowrishankar, R. Huang, K.M. Liechti, On determining mixed-mode traction-separation relations for interfaces. Int. J. Fracture 202, 1-19 (2016). DOI: 10.1007/s10704-016-0128-4.
  12. P. Wang, K.M. Liechti, R. Huang, Snap transitions of pressurized graphene blisters. Journal of Applied Mechanics 83, 071002 (2016). DOI: 10.1115/1.4033305.
  13. P. Wang, W. Gao, R. Huang, Entropic effects of thermal rippling on van der Waals interactions between monolayer graphene and a rigid substrate. J. Applied Physics 119, 074305 (2016). Preprint at arXiv:1511.02914.
  14. Z. Cao, L. Tao, D. Akinwande, R. Huang, K.M. Liechti, Mixed-mode traction-separation relations between graphene and copper by blister tests. Int. J. Solids and Structures 84, 147-159 (2016). DOI: 10.1016/j.ijsolstr.2016.01.023.
  15. N. Bouklas, C.M. Landis, R. Huang, Effect of solvent diffusion on crack-tip fields and driving force for fracture of hydrogels. Journal of Applied Mechanics 82, 081007 (2015). DOI: 10.1115/1.4030587.
  16. T. Jiang, C. Wu, J. Im, R. Huang, P.S. Ho, Impact of grain structure and material properties on via extrusion in 3D interconnects. J. Microelectronics and Electronic Packaging 12, 118-122 (2015). DOI: 10.4071/imaps.456.
  17. Z. Cao, L. Tao, D. Akinwande, R. Huang, K.M. Liechti, Mixed-mode interactions between graphene and substrates by blister tests. Journal of Applied Mechanics 82, 081008 (2015). DOI: 10.1115/1.4030591.
  18. W. Gao, K.M. Liechti, R. Huang, Wet adhesion of graphene. Extreme Mechanics Letters 3, 130-140 (2015). DOI: 10.1016/j.eml.2015.04.003.
  19. N. Bouklas, C.M. Landis, R. Huang, A nonlinear, transient finite element method for coupled solvent diffusion and large deformation of hydrogels. J. Mech. Phys. Solids 79, 21-43 (2015). DOI: 10.1016/j.jmps.2015.03.004.
  20. T. Jiang, J. Im, R. Huang, P.S. Ho, Through-silicon via stress characteristics and reliability impact on 3D Integrated Circuits. MRS Bulletin 40, 248-256 (2015).
  21. S.R. Na, J.W. Suk, L. Tao, D. Akinwande, R.S. Ruoff, R. Huang, K. M. Liechti, Selective Mechanical Transfer of Graphene from Seed Copper Foil Using Rate Effects. ACS Nano 9, 1325-1335 (2015). DOI: 10.1021/nn505178g.
  22. S. Chatterjee, C. McDonald, J. Niu, S. Velankar, P. Wang, R. Huang, Wrinkling and folding of thin films by viscous stress. Soft Matter 11, 1814-1827 (2015). DOI: 10.1039/C4SM02501F.
  23. S.R. Na, J.W. Suk, R.S. Ruoff, R. Huang, K. M. Liechti, Ultra Long-Range Interactions between Large Area Graphene and Silicon. ACS Nano 8, 11234-11242 (2014). DOI: 10.1021/nn503624f.
  24. K. Pan, Y. Ni, L. He, R. Huang, Nonlinear analysis of compressed elastic thin films on elastic substrates: from wrinkling to buckle-delamination. International Journal of Solids and Structures 51, 3715-3726 (2014). DOI: 10.1016/j.ijsolstr.2014.07.005.
  25. T. Jiang, C. Wu, N. Tamura, M. Kunz, B. Kim, H.-Y. Son, M. Suh, J. Im, R. Huang, P.S. Ho, Study of stresses and plasticity in through-silicon via structures for 3D interconnects by x-ray micro-beam diffraction. IEEE Trans. on Device and Materials Reliability 14, 698-703 (2014). DOI: 10.1109/TDMR.2014.2310705.
  26. W. Gao, P. Xiao, G. Henkelman, K.M. Liechti, R. Huang, Interfacial adhesion between graphene and silicon dioxide by density functional theory with van der Waals corrections. J. Phys. D: Appl. Phys. 47, 255301 (2014). arXiv:1403.3751.
  27. Z. Wu, J. Meng, Y. Liu, H. Li, R. Huang, A state space method for surface instability of elastic layers with material properties varying in thickness direction. Journal of Applied Mechanics 81, 081003 (2014).
  28. W. Gao and R. Huang, Thermomechanics of monolayer graphene: Rippling, thermal expansion and elasticity. Journal of the Mechanics and Physics of Solids 66, 42-58 (2014). DOI: 10.1016/j.jmps.2014.01.011.
  29. V. Nayyar, K. Ravi-Chandar, R. Huang, Stretch-induced wrinkling of polyethylene thin sheets: experiments and modeling. International Journal of Solids and Structures 51, 1847-1858 (2014). DOI: 10.1016/j.ijsolstr.2014.01.028
  30. Z. Cao, P. Wang, W. Gao, L. Tao, J.W. Suk, R.S. Ruoff, D. Akinwande, R. Huang, K.M. Liechti, A blister test for interfacial adhesion of large-scale transferred graphene. Carbon 69, 390-400 (2014) . DOI: 10.1016/j.carbon.2013.12.041.
  31. T. Jiang, R. Huang, Y. Zhu, Interfacial Sliding and Buckling of Monolayer Graphene on a Stretchable Substrate. Advanced Functional Materials 24, 396-402 (2014). Supporting Information. DOI: 10.1002/adfm.201301999.
  32. S.-K. Ryu, T. Jiang, J. Im, P.S. Ho, R. Huang, Thermo-mechanical failure analysis of through-silicon via interface using a shear-lag model with cohesive zone. IEEE Trans. on Device and Materials Reliability 14, 318-326 (2014). DOI: 10.1109/TDMR.2013.2261300.
  33. S.-K. Ryu, J. Im, P.S. Ho, R. Huang, A kinetic decomposition process for air-gap interconnects and induced deformation instability of a low-k dielectric cap layer. J. Mechanical Science and Technology 28, 255-261 (2014).
  34. T. Jiang, C. Wu, L. Spinella, J. Im, N. Tamura, M. Kunz, H.-Y. Son, B.G. Kim, R. Huang, P.S. Ho, Plasticity mechanism for copper extrusion in through-silicon vias for three-dimensional interconnects. Appl. Phys. Lett. 103, 211906 (2013).
  35. F. Weiss, S. Cai, Y. Hu, M. K. Kang, R. Huang, Z. Suo, Creases and wrinkles on the surface of a swollen gel. J. Applied Physics 114, 073507 (2013).
  36. P. Wang, W. Gao, Z. Cao, K.M. Liechti, R. Huang, Numerical analysis of circular graphene bubbles. J. Applied Mechanics 80, 040905 (2013). doi:10.1115/1.4024169.
  37. T. Jiang, S.-K. Ryu, Q. Zhao, J. Im, R. Huang and P.S. Ho, Measurement and Analysis of Thermal Stresses in 3D Integrated Structures Containing Through-Silicon Vias. Microelectronics Reliability 53, 53-62 (2013). DOI: 10.1016/j.microrel.2012.05.008. "Highly Cited Research in Microelectronics Reliability".
  38. Z. Wu, N. Bouklas, R. Huang, Swell-induced surface instability of hydrogel layers with material properties varying in thickness direction. Int. J. Solids and Structures 50, 578-587 (2013). DOI: 10.1016/j.ijsolstr.2012.10.022.
  39. J.-H. Lee, H.W. Ro, R. Huang, P. Lemaillet, T.A. Germer, C.L. Soles, C.M. Stafford, Anisotropic, Hierarchical Surface Patterns via Surface Wrinkling of Nanoimprinted Polymer Films. Nano Letters 12, 5995-5999 (2012). DOI: 10.1021/nl303512d.
  40. K. Yue, W. Gao, R. Huang, K.M. Liechti, Analytical methods for the mechanics of graphene bubbles. J. Appl. Phys. 112, 083512 (2012).
  41. S. Gowrishankar, H. Mei, K.M. Liechti and R. Huang, A comparison of direct and iterative methods for determining traction-separation relations. International Journal of Fracture 177, 109-128 (2012). DOI: 10.1007/s10704-012-9758-3.
  42. N. Bouklas and R. Huang, Swelling kinetics of polymer gels: comparison of linear and nonlinear theories. Soft Matter 8, 8194-8203 (2012). DOI: 10.1039/C2SM25467K.
  43. C. Guo, V. Nayyar, Z. Zhang, Y. Chen, J. Miao, R. Huang and Q. Liu, Path-guided wrinkling of nanoscale metal films. Advanced Materials 24, 3010-3014 (2012). DOI: 10.1002/adma.201200540. Supporting Information and Back Cover.
  44. S.-K. Ryu, K.-H. Lu, T. Jiang, J. Im, R. Huang, P.S. Ho, Effect of Thermal Stresses on Carrier Mobility and Keep-out Zone around Through-Silicon Vias for 3-D Integration. IEEE Trans. on Device and Materials Reliability 12, 255-262 (2012). DOI: 10.1109/TDMR.2012.2194784. Front cover.
  45. T. Lu, J. Huang, C. Jordi, G. Kovacs, R. Huang, D.R. Clarke, Z. Suo, Dielectric elastomer actuators under equi-biaxial forces, uniaxial forces, and uniaxial constraint of stiff fibers. Soft Matter 8, 6167-6173 (2012). DOI: 10.1039/c2sm25692d.
  46. S.-K. Ryu, Q. Zhao, M. Hecker, H. Y. Son, K. Y. Byun, J. Im, P.S. Ho, and R. Huang, Micro-Raman Spectroscopy and Analysis of Near-Surface Stresses in Silicon around Through-Silicon Vias for Three-Dimensional Interconnects. J. Appl. Phys. 111, 063513 (2012).
  47. J. Li, Y. An, R. Huang, H. Jiang, T. Xie, Unique aspects of a shape memory polymer as the substrate for surface wrinkling. ACS Applied Materials and Interfaces 4, 598-603 (2012). DOI: 10.1021/am201727a
  48. R. Huang and Z. Suo, Electromechanical phase transition in dielectric elastomers. Proc. Royal Soc. A 468, 1014-1040 (2012). DOI: 10.1098/rspa.2011.0452.
  49. S.-K. Ryu, T. Jiang, K.H. Lu, J. Im, H.-Y. Son, K.-Y. Byun, R. Huang, and P.S. Ho, Characterization of thermal stresses in through-silicon vias for three-dimensional interconnects by bending beam technique. Applied Physics Letters 100, 041901 (2012).
  50. W. Gao and R. Huang, Effect of surface roughness on adhesion of graphene membranes. J. Phys. D: Appl. Phys. 44, 452001 (2011).
  51. V. Nayyar, K. Ravi-Chandar, R. Huang, Stretch-induced stress patterns and wrinkles in hyperelastic thin sheets. International Journal of Solids and Structures 48, 3471-3483 (2011). DOI: 10.1016/j.ijsolstr.2011.09.004.
  52. H. Mei, C.M. Landis, R. Huang, Concomitant wrinkling and buckle-delamination of elastic thin films on compliant substrates. Mechanics of Materials 43, 627-642 (2011). DOI: 10.1016/j.mechmat.2011.08.003.
  53. R. Huang, Graphene: Show of adhesive strength (news and views). Nature Nanotechnology 6, 537-538 (2011).
  54. M.K. Kang and R. Huang, Swell-induced instability of substrate-attached hydrogel lines. Int. J. Applied Mechanics 3, 219-233 (2011). DOI: 10.1142/S1758825111000956.
  55. Q. Lu, W. Gao and R. Huang, Atomistic simulation and continuum modeling of graphene nanoribbons under uniaxial tension. Modelling and Simulation in Materials Science and Engineering 19, 054006 (2011). Posted online at arXiv:1007.3298.
  56. M. Caldorera-Moore, M.K. Kang, Z. Moore, V. Singh, S.V. Sreenivasan, L. Shi, R. Huang, K. Roy, Swelling behavior of nanoscale shape- and size-specific hydrogel particles fabricated using imprint lithography. Soft Matter 7, 2879-2887 (2011). DOI: 10.1039/C0SM01185A.
  57. S.-K. Ryu, K.-H. Lu, X. Zhang, J. Im, P.S. Ho, and R. Huang, Impact of Near-Surface Thermal Stresses on Interfacial Reliability of Through-Silicon-Vias for 3-D Interconnects. IEEE Trans. on Device and Materials Reliability 11, 35-43 (2011). DOI: 10.1109/TDMR.2010.2068572.
  58. M.K. Kang and R. Huang, Effect of surface tension on swell-induced surface instability of substrate-confined hydrogel layers. Soft Matter 6, 5736-5742 (2010). DOI: 10.1039/c0sm00335b.
  59. M.K. Kang and R. Huang, Swell induced surface instability of confined hydrogel layers on substrates. J. Mech. Phys. Solids 58, 1582-1598 (2010). DOI: 10.1016/j.jmps.2010.07.008.
  60. M.K. Kang and R. Huang, A Variational Approach and Finite Element Implementation for Swelling of Polymeric Hydrogels under Geometric Constraints. J. Appl. Mech. 77, 061004 (2010). DOI: 10.1115/1.4001715.
  61. Z.H. Aitken and R. Huang, Effects of mismatch strain and substrate surface corrugation on morphology of supported monolayer graphene. J. Appl. Phys. 107, 123531 (2010). Posted online at arXiv:1003.0853.
  62. J.H. Seol, I. Jo, A.L. Moore, L. Lindsay, Z.H. Aitken, M.T. Pettes, X. Li, Z. Yao, R. Huang, D. Broido, N. Mingo, R.S. Ruoff, and L. Shi, Two-dimensional phonon transport in supported graphene. Science 328, 213-216 (2010). DOI: 10.1126/science.1184014.
  63. Q. Lu and R. Huang, Excess energy and deformation along free edges of graphene nanoribbons. Physical Review B 81, 155410 (2010). Preprint posted online at arXiv:0910.0912, October 2009.
  64. E.P. Chan, K.A. Page, S.H. Im, D.L. Patton, R. Huang, C.M. Stafford, Viscoelastic properties of confined polymer films measured via thermal wrinkling. Soft Matter 5, 4638-4641 (2009).
  65. Q. Lu and R. Huang, Nonlinear mechanics of single-atomic-layer graphene sheets. Int. J. Applied Mechanics 1, 443-467 (2009).
  66. Y. Pang and R. Huang, Effect of Elastic Anisotropy on Surface Pattern Evolution of Epitaxial Thin Films. Int. J. Solids and Structures 46, 2822-2833 (2009).
  67. Q. Lu, M. Arroyo, R. Huang, Elastic bending modulus of monolayer graphene. J. Phys. D: Appl. Phys. 42, 102002 (2009). Posted online at arXiv:0901.4370v1.
  68. B. Li, Q. Zhao, H. Huang, Z. Luo, M.K. Kang, J.-H. Im, R. Allen, M.W. Cresswel, R. Huang, and P.S Ho, Indentation of Single-Crystal Silicon Nanolines: Buckling and Contact Friction at Nanoscales. J. Applied Physics 105, 073510 (2009).
  69. S. H. Im and R. Huang, Wrinkle Patterns of Anisotropic Crystal Films on Viscoelastic Substrates. J. Mech. Phys. Solids 56, 3315-3330 (2008). doi: 10.1016/j.jmps.2008.09.011.
  70. X. Zhang, S.-K. Ryu, R. Huang, P.S. Ho, J. Liu, D. Toma, Mechanical stability of air-gap interconnects. Future Fab 27, 81-87 (October 2008).
  71. M. K. Kang, B. Li, P.S. Ho, R. Huang, Buckling of Single-Crystal Silicon Nanolines under Indentation. Journal of Nanomaterials, Vol. 2008, Article ID 132728 (11 pages), April 2008. DOI: 10.1155/2008/132728.
  72. B. Li, M. K. Kang, K. Lu, R. Huang, P. S. Ho, R. A. Allen, and M. W. Cresswell, Fabrication and Characterization of Patterned Single-Crystal Silicon Nanolines. Nano Letters 8, 92 -98 (2008).
  73. J. Zhou and R. Huang, Internal lattice relaxation of single-layer graphene under in-plane deformation. Journal of the Mechanics and Physics of Solids 56, 1609-1623 (2008).
  74. H. Mei, Y. Pang, and R. Huang, Influence of interfacial delamination on channel cracking of elastic thin films. International Journal of Fracture 148, 331-342 (2007).
  75. H. Mei, J.H. An, R. Huang, and P.J. Ferreira, Finite element modeling of stress variation in multilayer thin-film specimens for in-situ transmission electron microscopy experiments. Journal of Materials Research 22, 2737-2741 (2007).
  76. H. Mei, J.Y. Chung, H.-H. Yu, C.M. Stafford, and R. Huang, Buckling modes of elastic thin films on elastic substrates. Applied Physics Letters 90, 151902 (2007).
  77. Y. Pang and R. Huang, Bifurcation of Surface Pattern in Epitaxial Thin Films under Anisotropic Stresses. J. Applied Physics 101, 023519 (2007).
  78. R. Huang, C.M. Stafford, B.D. Vogt, Effect of surface properties on wrinkling of ultrathin films. J. Aerospace Engineering 20, 38-44 (2007).
  79. R. Huang and S.H. Im, Dynamics of wrinkle growth and coarsening in stressed thin films. Physical Review E 74, 026214 (2006).
  80. Y. Pang and R. Huang, Nonlinear effect of stress and wetting on surface evolution in epitaxial thin films. Physical Review B 74, 075413 (2006).
  81. D.W. Gan, P.S. Ho, Y. Pang, R. Huang, J. Leu, J. Maiz, T. Scherban, Effect of passivation on stress relaxation in electroplated copper films. J. Materials Research 21, 1512-1518 (2006).
  82. C.M. Stafford, B.D. Vogt, C. Harrison, D. Julthongpiput, R. Huang, Elastic Moduli of Ultrathin Amorphous Polymer Films. Macromolecules 39, 5095-5099 (2006).
  83. M.K. Kang, R. Huang, T. Knowles, Torsional vibrations of circular elastic plates with thickness steps. IEEE Trans. Ultrasonics, Ferroelectrics and Frequency Control, vol. 53, 349-359 (2006).
  84. T. Knowles, M.K. Kang, R. Huang, Trapped torsional vibrations in elastic plates. Applied Physics Letters 87, 201911 (2005).
  85. R. Huang, Electrically induced surface instability of a conductive thin film on a dielectric substrate. Applied Physics Letters 87, 151911 (2005).
  86. H. Liu and R. Huang, Effect of a cap layer on morphological stability of a strained epitaxial film. J. Applied Physics 97, 113537 (2005).
  87. S.H. Im and R. Huang, Evolution of wrinkles in elastic-viscoelastic bilayer thin films. J. Applied Mechanics 72, 955-961 (2005).
  88. R. Huang, D.W. Gan, P.S. Ho, Isothermal stress relaxation in electroplated Cu films. Part II: Kinetic modeling. J. Applied Physics 97, 103532 (2005).
  89. D.W. Gan, R. Huang, P.S. Ho, J. Leu, J. Maiz, T. Scherban, Isothermal stress relaxation in electroplated Cu films. Part I: Mass transport measurements. J. Applied Physics 97, 103531 (2005).
  90. R. Huang, Kinetic wrinkling of an elastic film on a viscoelastic substrate. Journal of the Mechanics and Physics of Solids 53, 63-89 (2005).
  91. S.H. Im and R. Huang, Ratcheting-induced wrinkling of an elastic film on a metal layer under cyclic temperatures. Acta Mater 52, 3707-3719 (2004).
  92. H. Yin, R. Huang, K.D. Hobart, J. Liang, Z. Suo, S.R. Shieh, T.S. Duffy, F.J. Kub, J.C. Sturm, Buckling suppression of SiGe islands on compliant substrates. Journal of Applied Physics 94, 6875-6882 (2003).
  93. R. Huang, N. Sukumar, J.H. Prevost, Modeling quasi-static crack growth with the extended finite element method -Part II: Numerical Applications. International Journal of Solids and Structures 40, 7539-7552 (2003).
  94. R. Huang, J.H. Prevost, Z.Y. Huang, and Z. Suo, Channel-cracking of thin films with the extended finite element method. Engineering Fracture Mechanics 70, 2513-2526 (2003).
  95. J. Liang, R. Huang, J.H. Prevost, and Z. Suo, Evolving crack patterns in thin films with the extended finite element method. International Journal of Solids and Structures 40, 2343-2354 (2003).
  96. R. Huang and Z. Suo, Very thin solid-on-liquid structures: the interplay of flexural rigidity, membrane force , and interfacial force. Thin Solid Films 429, 273-281 (2003).
  97. J. Liang, R. Huang, J.H. Prevost, and Z. Suo, Thin film cracking modulated by underlayer creep. Experimental Mechanics, 43, 269-279 (2003).
  98. R. Huang, H. Yin, J. Liang, J.C. Sturm, K.D. Hobart, Z. Suo, Mechanics of relaxing SiGe islands on a viscous glass. Acta Mechanica Sinica (English) 18, 441-456 (2002).
  99. R. Huang, J.H. Prevost, and Z. Suo, Loss of constraint on fracture in thin film structures due to creep. Acta Materialia 50, 4137-4148 (2002).
  100. H. Yin, R. Huang, K.D. Hobart, Z. Suo, T.S. Kuan, C.K. Inoki, S.R. Shieh, T.S. Duffy, F.J. Kub, J.C. Sturm, Strain relaxation of SiGe islands on compliant oxide. Journal of Applied Physics 91, 9716-9722 (2002).
  101. J. Liang, R. Huang, H. Yin, J. C. Sturm, K. D. Hobart, and Z. Suo, Relaxation of compressed elastic islands on a viscous layer. Acta Materialia 50, 2933-2944 (2002).
  102. R. Huang and Z. Suo, Instability of a compressed elastic film on a viscous layer. International Journal of Solids and Structures 39, 1791-1802 (2002).
  103. R. Huang and Z. Suo, Wrinkling of a compressed elastic film on a viscous layer. Journal of Applied Physics 91, 1135-1142 (2002).
  104. R. Huang, Z. Suo, J. H. Prevost, and W. D. Nix, Inhomogeneous deformation in metallic glasses. Journal of the Mechanics and Physics of Solids 50, 1011-1027 (2002).
  105. R. Huang, P.C.Y. Lee,W.S. Lin and J.D. Yu, Extensional, thickness-stretch, and symmetric thickness-shear vibrations of piezoelectric ceramic disks. IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control 49, 1507-1515 (2002).
  106. P.C. Y. Lee and R. Huang, Mechanical effects of electrodes on the vibrations of quartz crystal plates. IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control 49, 612-625 (2002).
  107. P.C.Y. Lee and R. Huang, Effects of a liquid layer on thickness-shear vibrations of rectangular AT-cut quartz plates. IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control 49, 604-611 (2002).
  108. P.C.Y. Lee, R. Huang, X. Li, and W. H. Shih, Vibrations and static responses of asymmetric bimorph disks of piezoelectric ceramics. IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control 47, 706-715 (2000).
  109. J.L. Yu and R. Huang, Numerical simulation and a simplified model for the early-stage response of a mild steel beam under impact loading. Acta Mechanica Sinica (Chinese) 29, 464-469 (1997).

Book Chapters:
  1. S.-K. Ryu, T. Jiang, J. Im, R. Huang, P.S. Ho, Thermal Stress in 3-D Packaging. In: Encyclopedia of Thermal Stresses (Editor: Hetnarski RB), Vol x, pp 5208-5217. Springer Dordrecht, 2014.
  2. R. Huang, A Kinetics Approach to Surface Wrinkling of Elastic Films. Chapter 5 in: Mechanical Self-Assem bly: Science and Applications (Editor: X. Chen), Springer, 2013.
  3. Q. Lu and R. Huang, Mechanical Behavior of Monolayer Graphene by Continuum and Atomistic Modeling. Chapter 14 in: Simulations in Nanobiotechnology (Editor: K. Eom), CRC Press, 2011.
  4. X. Zhang, S. H. Im, R. Huang, P. S. Ho, Chip-Packaging Interaction and Reliability Impact on Cu/Low-k Interconnects. Chapter 2 in: Integrated Interconnect Technologies for 3D Nanoelectronic Systems (Editors: M. Bakir and J. Meindl), Artech House, Norwood, MA, 2008.

Selected Conference Proceedings:
  1. C. Wu, T. Jiang, J. Im, K. M. Liechti, R. Huang, P. S. Ho, Material characterization and failure analysis of through-silicon vias. Proc. IEEE 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), pp. 312-316 (Singapore, June 30-July 4, 2014). DOI: 10.1109/IPFA.2014.6898206.
  2. T. Jiang, C. Wu, P. Su, P. Chia, L. Li, H.-Y. Son, M.-S. Suh, N.-S. Kim, J. Im, R. Huang, P.S. Ho, Effect of high temperature storage on the stress and reliability of 3D stacked chip. Proc. IEEE 64th Electronic Components and Technology Conference (ECTC), pp. 1122-1127 (Orlando, FL, May 27-30, 2014). DOI: 10.1109/ECTC.2014.6897430.
  3. T. Jiang, C. Wu, J. Im, R. Huang, P.S. Ho, Effect of microstructure on via extrusion profile and reliability implication for copper through-silicon vias (TSVs) structures. Proc. 2014 IEEE International Interconnect Technology Conference/Advanced Metallization Conference (IITC/AMC), pp. 377-380 (San Jose, CA, May 20-23, 2014). DOI: 10.1109/IITC.2014.6831838.
  4. T. Jiang, S.-K. Ryu, Q. Zhao, J. Im, P.S. Ho, R. Huang, Thermomechanical characterization and modeling for TSV structures. AIP Conf. Proc. 1601, 148-157 (2014). DOI: 10.1063/1.4881348.
  5. T. Jiang, S.-K. Ryu, J. Im, R. Huang and P.S. Ho, Characterization of thermal stresses and plasticity in through-silicon via structures for three-dimensional integration. AIP Conf. Proc. 1601, 55-66 (2014). DOI: 10.1063/1.4881340.
  6. H. Mei and R. Huang, Wrinkling and Delamination of Thin Films on Compliant Substrates. Proc. 13th International Conference on Fracture (June 2013, Beijing, China).
  7. Tengfei Jiang, Suk-Kyu Ryu, Jay Im, Ho-Young Son, Nam-Seog Kim, Rui Huang, Paul S Ho, Impact of material and microstructure on thermal stresses and reliability of through-silicon via (TSV) structures. Proc. 2013 IEEE International Interconnect Technology Conference (IITC), June 2013, Kyoto, Japan.
  8. Tengfei Jiang, Chenglin Wu, Peng Su, Xi Liu, Pierre Chia, Li Li, Ho-Young Son, Jae-Sung Oh, Kwang-Yoo Byun, Nam-Seog Kim, Jay Im, Rui Huang, Paul S Ho, Characterization of plasticity and stresses in TSV structures in stacked dies using synchrotron x-ray microdiffraction. Proc. 2013 IEEE Electronic Components and Technology Conference (ECTC), 641-647 (May 2013, Las Vegas, NV).
  9. Qiu Zhao, J. Im, R. Huang, P.S. Ho, Extension of micro-Raman spectroscopy for full-component stress characterization of TSV structures. Proc. 2013 IEEE Electronic Components and Technology Conference (ECTC), 397-401 (May 2013, Las Vegas, NV).
  10. Tengfei Jiang, Suk-Kyu Ryu, Qiu Zhao, Jay Im, Ho-Young Son, Kwang-Yoo Byun, Rui Huang, Paul S Ho, Thermal stress characteristics and reliability impact on 3-D ICs containing through-silicon-vias. Proc. 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (ICSICT), October 2012, Xi'an, China.
  11. Tengfei Jiang, Suk-Kyu Ryu, Qiu Zhao, Jay Im, Ho-Young Son, Kwang-Yoo Byun, Rui Huang, Paul S Ho, Thermal Stress Characteristics and Impact on Device Keep-out Zone for 3-D ICs Containing Through-Silicon-Vias. Proc. 2012 IEEE Symposium on VLSI Technology, 103-104 (June 2012, Honolulu, HI).
  12. Q. Lu and R. Huang, Nonlinear Mechanical Properties of Graphene Nanoribbons, MRS Proceedings, vol. 1284, mrsf10-1284-c14-02 (2011). DOI: 10.1557/opl.2011.226.
  13. K.H. Lu, S.-K. Ryu, Q. Zhao, K. Hummler, J. Im, R. Huang, P. S. Ho, Temperature-dependent Thermal Stress Determination for Through-Silicon-Vias (TSVs) by Combining Bending Beam Technique with Finite Element Analysis. Proc. IEEE Electronic Components and Technology Conference (ECTC), 1475-1480 (Lake Buena Vista, FL, 2011). DOI: 10.1109/ECTC.2011.5898705.
  14. J. Mitra, M. Jung, S.-K. Ryu, R. Huang, S.-K. Lim, D. Z. Pan, A fast simulation framework for full-chip thermo-mechanical stress and reliability analysis of through-silicon-via based 3D ICs. Proc. IEEE Electronic Components and Technology Conference (ECTC), 746-753 (Lake Buena Vista, FL, 2011). DOI: 10.1109/ECTC.2011.5898596.
  15. K.-H. Lu, S.-K. Ryu, J. Im, R. Huang, P. S. Ho, Thermomechanical reliability of through-silicon vias in 3D interconnects. Proc. 2011 IEEE International Reliability Physics Symposium (IRPS), 3D.1 (Monterey CA, 2011). DOI: 10.1109/IRPS.2011.5784487.
  16. S.-K. Ryu, K.-H. Lu, J. Im, R. Huang, P. S. Ho, Stress-Induced Delamination Of Through Silicon Via Structures. In: International Workshop on Stress Management for 3D ICs Using Through Silicon Vias. AIP Conf. Proc. 1378, 153-167 (2011). DOI: 10.1063/1.3615702.
  17. H. Mei, S. Gowrishankar, K. M. Liechti, R. Huang, Initiation and propagation of interfacial delamination in integrated thin-film structures. Proc. 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Las Vegas, NV, June 2010. DOI: 10.1109/ITHERM.2010.5501290.
  18. K.H. Lu, S.-K. Ryu, Q. Zhao, X. Zhang, J. Im, R. Huang, P. S. Ho, Thermal stress induced delamination of through silicon vias in 3-D interconnects. Proc. IEEE Electronic Components and Technology Conference (ECTC), 40-45 (Las Vegas, NV, 2010). DOI: 10.1109/ECTC.2010.5490883.
  19. S.-K. Ryu, K.-H. Lu, X. Zhang, J. Im, P. S. Ho, R. Huang, Thermomechanical Reliability Challenges For 3D Interconnects With Through-Silicon Vias. In: 11th International Workshop on Stress-Induced Phenomena in Metallization. AIP Conf. Proc. 1300, 189-201 (2010). doi: 10.1063/1.3527126.
  20. K.H. Lu, X. Zhang, S.-K. Ryu, J. Im, R. Huang, P. S. Ho, Thermo-mechanical reliability of 3-D ICs containing through silicon vias. Proc. IEEE Electronic Components and Technology Conference (ECTC), 630-634 (San Diego, CA, 2009). DOI: 10.1109/ECTC.2009.5074079.
  21. K.H. Lu, X. Zhang, S.-K. Ryu, R. Huang, P. S. Ho, Thermal Stresses Analysis of 3-D Interconnect. In: 10th International Workshop on Stress-Induced Phenomena in Metallization. AIP Conf. Proc. 1143, 224-230 (2009). doi: 10.1063/1.3169263.
  22. X. Zhang, R. S. Smith, R. Huang, P. S. Ho, Chip-Package Interaction and Crackstop Study for Cu/Ultra low-k Interconnects. In: 10th International Workshop on Stress-Induced Phenomena in Metallization. AIP Conf. Proc. 1143, 197-203 (2009). doi: 10.1063/1.3169259.
  23. X. Zhang, S.-K. Ryu, R. Huang, P. S. Ho, J. Liu, D. Toma, Impact of process induced stresses and chip-packaging interaction on reliability of air-gap interconnects. Proc. 2008 IEEE International Interconnect Technology Conference (IITC), 135-137 (Burlingame, CA, 2008). DOI: 10.1109/IITC.2008.4546947.
  24. H. Mei, Y. Pang, S. H. Im, R. Huang, Fracture, delamination, and buckling of elastic thin films on compliant substrates. Proc. 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), pp. 762-769, Orlando, FL, May 2008. DOI: 10.1109/ITHERM.2008.4544345.
  25. B. Li, H. Huang, Q. Zhao, Z. Luo, J.-H. Im, P.S Ho, M.K. Kang, R. Huang, and M.W. Cresswel, Mechanical Characterization of High Aspect Ratio Silicon Nanolines. In: Mechanics of Nanoscale Materials, edited by C. Friesen, R.C. Cammarata, A. Hodge, O.L. Warren (Mater. Res. Soc. Symp. Proc., vol. 1086E, Warrendale, PA, 2008), 1086-U05-07.
  26. Y. Pang and R. Huang, Influence of interfacial delamination on channel cracking of brittle thin films. In: Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics, edited by Q. Lin, E.T. Ryan, W-L. Wu, D.Y. Yoon (Mater. Res. Soc. Symp. Proc. Vol. 990, Warrendale, PA), B06-04, 2007.
  27. Y. Pang and R. Huang, Pattern Evolution of Self-Assembled Quantum Dots Under Biaxial Stresses. In: Nanomanufacturing, edited by F. Stellacci, J.W. Perry, G.S. Herman, and R.N. Das (Mater. Res. Soc. Symp. Proc., vol. 921E, Warrendale, PA, 2006), 0921-T07-08.
  28. R. Huang, C.M. Stafford, B.D. Vogt, Wrinkling of ultrathin polymer films. In: Mechanics of Nanoscale Materials and Devices, edited by A. Misra, J.P. Sullivan, H. Huang, K. Lu, and S. Asif (Mater. Res. Soc. Symp. Proc., vol. 924E, Warrendale, PA, 2006), 0924-Z04-10.
  29. S.H. Im and R. Huang, Morphological instability and kinetics of an elastic film on a viscoelastic layer. Proceedings of IUTAM Symposium on Size Effects on Material and Structure Behavior at Micron- and Nano-Scales (Eds. Q.P. Sun and P. Tong, Hong Kong, 31 May - 4 June, 2004), Springer 2006, pp. 41-50.
  30. D.W. Gan, R. Huang, P.S. Ho, J. Leu, J. Maiz, T. Scherban, Effects of passivation layer on stress relaxation and mass transport in electroplated Cu films. Proceedings of the 7th International Workshop on Stress-Induced Phenomena in Metallization, Austin, Texas, 14-16 June 2004. AIP Conference Proceedings 741, 256-267 (2004).
  31. R. Huang, Z. Suo, Morphological instability of solid-on-liquid thin film structures. MRS Symposium Proceedings, vol. 749, 121-126 (2002).
  32. R. Huang, H. Yin, J. Liang, K. D. Hobart, J. C. Sturm, and Z. Suo, Relaxation of a strained elastic film on a viscous layer. MRS Symposium Proceedings, vol. 695, 115-120 (2001).