Rui Huang's portrait

Rui Huang

Associate Professor
Aerospace Engineering and Engineering Mechanics
University of Texas at Austin
Email: ruihuang@mail.utexas.edu
Phone: 1-512-471-7558

Journal Publications:
  1. T. Jiang, S.-K. Ryu, Q. Zhao, J. Im, R. Huang and P.S. Ho, Measurement and Analysis of Thermal Stresses in 3D Integrated Structures Containing Through-Silicon Vias. Microelectronics Reliability 53, 53-62 (2013). DOI: 10.1016/j.microrel.2012.05.008.
  2. Z. Wu, N. Bouklas, R. Huang, Swell-induced surface instability of hydrogel layers with material properties varying in thickness direction. Int. J. Solids and Structures 50, 578-587 (2013). DOI: 10.1016/j.ijsolstr.2012.10.022.
  3. J.-H. Lee, H.W. Ro, R. Huang, P. Lemaillet, T.A. Germer, C.L. Soles, C.M. Stafford, Anisotropic, Hierarchical Surface Patterns via Surface Wrinkling of Nanoimprinted Polymer Films. Nano Letters 12, 5995-5999 (2012). DOI: 10.1021/nl303512d.
  4. K. Yue, W. Gao, R. Huang, K.M. Liechti, Analytical methods for the mechanics of graphene bubbles. J. Appl. Phys. 112, 083512 (2012).
  5. S. Gowrishankar, H. Mei, K.M. Liechti and R. Huang, A comparison of direct and iterative methods for determining traction-separation relations. International Journal of Fracture 177, 109-128 (2012). DOI: 10.1007/s10704-012-9758-3.
  6. N. Bouklas and R. Huang, Swelling kinetics of polymer gels: comparison of linear and nonlinear theories. Soft Matter 8, 8194-8203 (2012). DOI: 10.1039/C2SM25467K.
  7. C. Guo, V. Nayyar, Z. Zhang, Y. Chen, J. Miao, R. Huang and Q. Liu, Path-guided wrinkling of nanoscale metal films. Advanced Materials 24, 3010-3014 (2012). DOI: 10.1002/adma.201200540. Supporting Information and Back Cover.
  8. S.-K. Ryu, K.-H. Lu, T. Jiang, J. Im, R. Huang, P.S. Ho, Effect of Thermal Stresses on Carrier Mobility and Keep-out Zone around Through-Silicon Vias for 3-D Integration. IEEE Trans. on Device and Materials Reliability 12, 255-262 (2012). DOI: 10.1109/TDMR.2012.2194784. Front cover.
  9. T. Lu, J. Huang, C. Jordi, G. Kovacs, R. Huang, D.R. Clarke, Z. Suo, Dielectric elastomer actuators under equi-biaxial forces, uniaxial forces, and uniaxial constraint of stiff fibers. Soft Matter 8, 6167-6173 (2012). DOI: 10.1039/c2sm25692d.
  10. S.-K. Ryu, Q. Zhao, M. Hecker, H. Y. Son, K. Y. Byun, J. Im, P.S. Ho, and R. Huang, Micro-Raman Spectroscopy and Analysis of Near-Surface Stresses in Silicon around Through-Silicon Vias for Three-Dimensional Interconnects. J. Appl. Phys. 111, 063513 (2012).
  11. J. Li, Y. An, R. Huang, H. Jiang, T. Xie, Unique aspects of a shape memory polymer as the substrate for surface wrinkling. ACS Applied Materials and Interfaces 4, 598-603 (2012). DOI: 10.1021/am201727a
  12. R. Huang and Z. Suo, Electromechanical phase transition in dielectric elastomers. Proc. Royal Soc. A 468, 1014-1040 (2012). DOI: 10.1098/rspa.2011.0452.
  13. S.-K. Ryu, T. Jiang, K.H. Lu, J. Im, H.-Y. Son, K.-Y. Byun, R. Huang, and P.S. Ho, Characterization of thermal stresses in through-silicon vias for three-dimensional interconnects by bending beam technique. Applied Physics Letters 100, 041901 (2012).
  14. W. Gao and R. Huang, Effect of surface roughness on adhesion of graphene membranes. J. Phys. D: Appl. Phys. 44, 452001 (2011).
  15. V. Nayyar, K. Ravi-Chandar, R. Huang, Stretch-induced stress patterns and wrinkles in hyperelastic thin sheets. International Journal of Solids and Structures 48, 3471-3483 (2011). DOI: 10.1016/j.ijsolstr.2011.09.004.
  16. H. Mei, C.M. Landis, R. Huang, Concomitant wrinkling and buckle-delamination of elastic thin films on compliant substrates. Mechanics of Materials 43, 627-642 (2011). DOI: 10.1016/j.mechmat.2011.08.003.
  17. R. Huang, Graphene: Show of adhesive strength (news and views). Nature Nanotechnology 6, 537-538 (2011).
  18. M.K. Kang and R. Huang, Swell-induced instability of substrate-attached hydrogel lines. Int. J. Applied Mechanics 3, 219-233 (2011). DOI: 10.1142/S1758825111000956.
  19. Q. Lu, W. Gao and R. Huang, Atomistic simulation and continuum modeling of graphene nanoribbons under uniaxial tension. Modelling and Simulation in Materials Science and Engineering 19, 054006 (2011). Posted online at arXiv:1007.3298.
  20. M. Caldorera-Moore, M.K. Kang, Z. Moore, V. Singh, S.V. Sreenivasan, L. Shi, R. Huang, K. Roy, Swelling behavior of nanoscale shape- and size-specific hydrogel particles fabricated using imprint lithography. Soft Matter 7, 2879-2887 (2011). DOI: 10.1039/C0SM01185A.
  21. S.-K. Ryu, K.-H. Lu, X. Zhang, J. Im, P.S. Ho, and R. Huang, Impact of Near-Surface Thermal Stresses on Interfacial Reliability of Through-Silicon-Vias for 3-D Interconnects. IEEE Trans. on Device and Materials Reliability 11, 35-43 (2011). DOI: 10.1109/TDMR.2010.2068572.
  22. M.K. Kang and R. Huang, Effect of surface tension on swell-induced surface instability of substrate-confined hydrogel layers. Soft Matter 6, 5736-5742 (2010). DOI: 10.1039/c0sm00335b.
  23. M.K. Kang and R. Huang, Swell induced surface instability of confined hydrogel layers on substrates. J. Mech. Phys. Solids 58, 1582-1598 (2010). DOI: 10.1016/j.jmps.2010.07.008.
  24. M.K. Kang and R. Huang, A Variational Approach and Finite Element Implementation for Swelling of Polymeric Hydrogels under Geometric Constraints. J. Appl. Mech. 77, 061004 (2010). DOI: 10.1115/1.4001715.
  25. Z.H. Aitken and R. Huang, Effects of mismatch strain and substrate surface corrugation on morphology of supported monolayer graphene. J. Appl. Phys. 107, 123531 (2010). Posted online at arXiv:1003.0853.
  26. J.H. Seol, I. Jo, A.L. Moore, L. Lindsay, Z.H. Aitken, M.T. Pettes, X. Li, Z. Yao, R. Huang, D. Broido, N. Mingo, R.S. Ruoff, and L. Shi, Two-dimensional phonon transport in supported graphene. Science 328, 213-216 (2010). DOI: 10.1126/science.1184014.
  27. Q. Lu and R. Huang, Excess energy and deformation along free edges of graphene nanoribbons. Physical Review B 81, 155410 (2010). Preprint posted online at arXiv:0910.0912, October 2009.
  28. E.P. Chan, K.A. Page, S.H. Im, D.L. Patton, R. Huang, C.M. Stafford, Viscoelastic properties of confined polymer films measured via thermal wrinkling. Soft Matter 5, 4638-4641 (2009).
  29. Q. Lu and R. Huang, Nonlinear mechanics of single-atomic-layer graphene sheets. Int. J. Applied Mechanics 1, 443-467 (2009).
  30. Y. Pang and R. Huang, Effect of Elastic Anisotropy on Surface Pattern Evolution of Epitaxial Thin Films. Int. J. Solids and Structures 46, 2822-2833 (2009).
  31. Q. Lu, M. Arroyo, R. Huang, Elastic bending modulus of monolayer graphene. J. Phys. D: Appl. Phys. 42, 102002 (2009). Posted online at arXiv:0901.4370v1.
  32. B. Li, Q. Zhao, H. Huang, Z. Luo, M.K. Kang, J.-H. Im, R. Allen, M.W. Cresswel, R. Huang, and P.S Ho, Indentation of Single-Crystal Silicon Nanolines: Buckling and Contact Friction at Nanoscales. J. Applied Physics 105, 073510 (2009).
  33. S. H. Im and R. Huang, Wrinkle Patterns of Anisotropic Crystal Films on Viscoelastic Substrates. J. Mech. Phys. Solids 56, 3315-3330 (2008). doi: 10.1016/j.jmps.2008.09.011.
  34. X. Zhang, S.-K. Ryu, R. Huang, P.S. Ho, J. Liu, D. Toma, Mechanical stability of air-gap interconnects. Future Fab 27, 81-87 (October 2008).
  35. M. K. Kang, B. Li, P.S. Ho, R. Huang, Buckling of Single-Crystal Silicon Nanolines under Indentation. Journal of Nanomaterials, Vol. 2008, Article ID 132728 (11 pages), April 2008. DOI: 10.1155/2008/132728.
  36. B. Li, M. K. Kang, K. Lu, R. Huang, P. S. Ho, R. A. Allen, and M. W. Cresswell, Fabrication and Characterization of Patterned Single-Crystal Silicon Nanolines. Nano Letters 8, 92 -98 (2008).
  37. J. Zhou and R. Huang, Internal lattice relaxation of single-layer graphene under in-plane deformation. Journal of the Mechanics and Physics of Solids 56, 1609-1623 (2008).
  38. H. Mei, Y. Pang, and R. Huang, Influence of interfacial delamination on channel cracking of elastic thin films. International Journal of Fracture 148, 331-342 (2007).
  39. H. Mei, J.H. An, R. Huang, and P.J. Ferreira, Finite element modeling of stress variation in multilayer thin-film specimens for in-situ transmission electron microscopy experiments. Journal of Materials Research 22, 2737-2741 (2007).
  40. H. Mei, J.Y. Chung, H.-H. Yu, C.M. Stafford, and R. Huang, Buckling modes of elastic thin films on elastic substrates. Applied Physics Letters 90, 151902 (2007).
  41. Y. Pang and R. Huang, Bifurcation of Surface Pattern in Epitaxial Thin Films under Anisotropic Stresses. J. Applied Physics 101, 023519 (2007).
  42. R. Huang, C.M. Stafford, B.D. Vogt, Effect of surface properties on wrinkling of ultrathin films. J. Aerospace Engineering 20, 38-44 (2007).
  43. R. Huang and S.H. Im, Dynamics of wrinkle growth and coarsening in stressed thin films. Physical Review E 74, 026214 (2006).
  44. Y. Pang and R. Huang, Nonlinear effect of stress and wetting on surface evolution in epitaxial thin films. Physical Review B 74, 075413 (2006).
  45. D.W. Gan, P.S. Ho, Y. Pang, R. Huang, J. Leu, J. Maiz, T. Scherban, Effect of passivation on stress relaxation in electroplated copper films. J. Materials Research 21, 1512-1518 (2006).
  46. C.M. Stafford, B.D. Vogt, C. Harrison, D. Julthongpiput, R. Huang, Elastic Moduli of Ultrathin Amorphous Polymer Films. Macromolecules 39, 5095-5099 (2006).
  47. M.K. Kang, R. Huang, T. Knowles, Torsional vibrations of circular elastic plates with thickness steps. IEEE Trans. Ultrasonics, Ferroelectrics and Frequency Control, vol. 53, 349-359 (2006).
  48. T. Knowles, M.K. Kang, R. Huang, Trapped torsional vibrations in elastic plates. Applied Physics Letters 87, 201911 (2005).
  49. R. Huang, Electrically induced surface instability of a conductive thin film on a dielectric substrate. Applied Physics Letters 87, 151911 (2005).
  50. H. Liu and R. Huang, Effect of a cap layer on morphological stability of a strained epitaxial film. J. Applied Physics 97, 113537 (2005).
  51. S.H. Im and R. Huang, Evolution of wrinkles in elastic-viscoelastic bilayer thin films. J. Applied Mechanics 72, 955-961 (2005).
  52. R. Huang, D.W. Gan, P.S. Ho, Isothermal stress relaxation in electroplated Cu films. Part II: Kinetic modeling. J. Applied Physics 97, 103532 (2005).
  53. D.W. Gan, R. Huang, P.S. Ho, J. Leu, J. Maiz, T. Scherban, Isothermal stress relaxation in electroplated Cu films. Part I: Mass transport measurements. J. Applied Physics 97, 103531 (2005).
  54. R. Huang, Kinetic wrinkling of an elastic film on a viscoelastic substrate. Journal of the Mechanics and Physics of Solids 53, 63-89 (2005).
  55. S.H. Im and R. Huang, Ratcheting-induced wrinkling of an elastic film on a metal layer under cyclic temperatures. Acta Mater 52, 3707-3719 (2004).
  56. H. Yin, R. Huang, K.D. Hobart, J. Liang, Z. Suo, S.R. Shieh, T.S. Duffy, F.J. Kub, J.C. Sturm, Buckling suppression of SiGe islands on compliant substrates. Journal of Applied Physics 94, 6875-6882 (2003).
  57. R. Huang, N. Sukumar, J.H. Prevost, Modeling quasi-static crack growth with the extended finite element method -Part II: Numerical Applications. International Journal of Solids and Structures 40, 7539-7552 (2003).
  58. R. Huang, J.H. Prevost, Z.Y. Huang, and Z. Suo, Channel-cracking of thin films with the extended finite element method. Engineering Fracture Mechanics 70, 2513-2526 (2003).
  59. J. Liang, R. Huang, J.H. Prevost, and Z. Suo, Evolving crack patterns in thin films with the extended finite element method. International Journal of Solids and Structures 40, 2343-2354 (2003).
  60. R. Huang and Z. Suo, Very thin solid-on-liquid structures: the interplay of flexural rigidity, membrane force , and interfacial force. Thin Solid Films 429, 273-281 (2003).
  61. J. Liang, R. Huang, J.H. Prevost, and Z. Suo, Thin film cracking modulated by underlayer creep. Experimental Mechanics, 43, 269-279 (2003).
  62. R. Huang, H. Yin, J. Liang, J.C. Sturm, K.D. Hobart, Z. Suo, Mechanics of relaxing SiGe islands on a viscous glass. Acta Mechanica Sinica (English) 18, 441-456 (2002).
  63. R. Huang, J.H. Prevost, and Z. Suo, Loss of constraint on fracture in thin film structures due to creep. Acta Materialia 50, 4137-4148 (2002).
  64. H. Yin, R. Huang, K.D. Hobart, Z. Suo, T.S. Kuan, C.K. Inoki, S.R. Shieh, T.S. Duffy, F.J. Kub, J.C. Sturm, Strain relaxation of SiGe islands on compliant oxide. Journal of Applied Physics 91, 9716-9722 (2002).
  65. J. Liang, R. Huang, H. Yin, J. C. Sturm, K. D. Hobart, and Z. Suo, Relaxation of compressed elastic islands on a viscous layer. Acta Materialia 50, 2933-2944 (2002).
  66. R. Huang and Z. Suo, Instability of a compressed elastic film on a viscous layer. International Journal of Solids and Structures 39, 1791-1802 (2002).
  67. R. Huang and Z. Suo, Wrinkling of a compressed elastic film on a viscous layer. Journal of Applied Physics 91, 1135-1142 (2002).
  68. R. Huang, Z. Suo, J. H. Prevost, and W. D. Nix, Inhomogeneous deformation in metallic glasses. Journal of the Mechanics and Physics of Solids 50, 1011-1027 (2002).
  69. R. Huang, P.C.Y. Lee,W.S. Lin and J.D. Yu, Extensional, thickness-stretch, and symmetric thickness-shear vibrations of piezoelectric ceramic disks. IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control 49, 1507-1515 (2002).
  70. P.C. Y. Lee and R. Huang, Mechanical effects of electrodes on the vibrations of quartz crystal plates. IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control 49, 612-625 (2002).
  71. P.C.Y. Lee and R. Huang, Effects of a liquid layer on thickness-shear vibrations of rectangular AT-cut quartz plates. IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control 49, 604-611 (2002).
  72. P.C.Y. Lee, R. Huang, X. Li, and W. H. Shih, Vibrations and static responses of asymmetric bimorph disks of piezoelectric ceramics. IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control 47, 706-715 (2000).
  73. J.L. Yu and R. Huang, Numerical simulation and a simplified model for the early-stage response of a mild steel beam under impact loading. Acta Mechanica Sinica (Chinese) 29, 464-469 (1997).
Selected Conference Proceedings:
  1. Q. Lu and R. Huang, Nonlinear Mechanical Properties of Graphene Nanoribbons, MRS Proceedings, vol. 1284, mrsf10-1284-c14-02 (2011). DOI: 10.1557/opl.2011.226.
  2. K.H. Lu, S.-K. Ryu, Q. Zhao, K. Hummler, J. Im, R. Huang, P. S. Ho, Temperature-dependent Thermal Stress Determination for Through-Silicon-Vias (TSVs) by Combining Bending Beam Technique with Finite Element Analysis. Proc. IEEE Electronic Components and Technology Conference (ECTC), 1475-1480 (Lake Buena Vista, FL, 2011). DOI: 10.1109/ECTC.2011.5898705.
  3. J. Mitra, M. Jung, S.-K. Ryu, R. Huang, S.-K. Lim, D. Z. Pan, A fast simulation framework for full-chip thermo-mechanical stress and reliability analysis of through-silicon-via based 3D ICs. Proc. IEEE Electronic Components and Technology Conference (ECTC), 746-753 (Lake Buena Vista, FL, 2011). DOI: 10.1109/ECTC.2011.5898596.
  4. K.-H. Lu, S.-K. Ryu, J. Im, R. Huang, P. S. Ho, Thermomechanical reliability of through-silicon vias in 3D interconnects. Proc. 2011 IEEE International Reliability Physics Symposium (IRPS), 3D.1 (Monterey CA, 2011). DOI: 10.1109/IRPS.2011.5784487.
  5. S.-K. Ryu, K.-H. Lu, J. Im, R. Huang, P. S. Ho, Stress-Induced Delamination Of Through Silicon Via Structures. In: International Workshop on Stress Management for 3D ICs Using Through Silicon Vias. AIP Conf. Proc. 1378, 153-167 (2011). DOI: 10.1063/1.3615702.
  6. H. Mei, S. Gowrishankar, K. M. Liechti, R. Huang, Initiation and propagation of interfacial delamination in integrated thin-film structures. Proc. 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Las Vegas, NV, June 2010. DOI: 10.1109/ITHERM.2010.5501290.
  7. K.H. Lu, S.-K. Ryu, Q. Zhao, X. Zhang, J. Im, R. Huang, P. S. Ho, Thermal stress induced delamination of through silicon vias in 3-D interconnects. Proc. IEEE Electronic Components and Technology Conference (ECTC), 40-45 (Las Vegas, NV, 2010). DOI: 10.1109/ECTC.2010.5490883.
  8. S.-K. Ryu, K.-H. Lu, X. Zhang, J. Im, P. S. Ho, R. Huang, Thermomechanical Reliability Challenges For 3D Interconnects With Through-Silicon Vias. In: 11th International Workshop on Stress-Induced Phenomena in Metallization. AIP Conf. Proc. 1300, 189-201 (2010). doi: 10.1063/1.3527126.
  9. K.H. Lu, X. Zhang, S.-K. Ryu, J. Im, R. Huang, P. S. Ho, Thermo-mechanical reliability of 3-D ICs containing through silicon vias. Proc. IEEE Electronic Components and Technology Conference (ECTC), 630-634 (San Diego, CA, 2009). DOI: 10.1109/ECTC.2009.5074079.
  10. K.H. Lu, X. Zhang, S.-K. Ryu, R. Huang, P. S. Ho, Thermal Stresses Analysis of 3-D Interconnect. In: 10th International Workshop on Stress-Induced Phenomena in Metallization. AIP Conf. Proc. 1143, 224-230 (2009). doi: 10.1063/1.3169263.
  11. X. Zhang, R. S. Smith, R. Huang, P. S. Ho, Chip-Package Interaction and Crackstop Study for Cu/Ultra low-k Interconnects. In: 10th International Workshop on Stress-Induced Phenomena in Metallization. AIP Conf. Proc. 1143, 197-203 (2009). doi: 10.1063/1.3169259.
  12. X. Zhang, S.-K. Ryu, R. Huang, P. S. Ho, J. Liu, D. Toma, Impact of process induced stresses and chip-packaging interaction on reliability of air-gap interconnects. Proc. 2008 IEEE International Interconnect Technology Conference (IITC), 135-137 (Burlingame, CA, 2008). DOI: 10.1109/IITC.2008.4546947.
  13. H. Mei, Y. Pang, S. H. Im, R. Huang, Fracture, delamination, and buckling of elastic thin films on compliant substrates. Proc. 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), pp. 762-769, Orlando, FL, May 2008. DOI: 10.1109/ITHERM.2008.4544345.
  14. B. Li, H. Huang, Q. Zhao, Z. Luo, J.-H. Im, P.S Ho, M.K. Kang, R. Huang, and M.W. Cresswel, Mechanical Characterization of High Aspect Ratio Silicon Nanolines. In: Mechanics of Nanoscale Materials, edited by C. Friesen, R.C. Cammarata, A. Hodge, O.L. Warren (Mater. Res. Soc. Symp. Proc., vol. 1086E, Warrendale, PA, 2008), 1086-U05-07.
  15. Y. Pang and R. Huang, Influence of interfacial delamination on channel cracking of brittle thin films. In: Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics, edited by Q. Lin, E.T. Ryan, W-L. Wu, D.Y. Yoon (Mater. Res. Soc. Symp. Proc. Vol. 990, Warrendale, PA), B06-04, 2007.
  16. Y. Pang and R. Huang, Pattern Evolution of Self-Assembled Quantum Dots Under Biaxial Stresses. In: Nanomanufacturing, edited by F. Stellacci, J.W. Perry, G.S. Herman, and R.N. Das (Mater. Res. Soc. Symp. Proc., vol. 921E, Warrendale, PA, 2006), 0921-T07-08.
  17. R. Huang, C.M. Stafford, B.D. Vogt, Wrinkling of ultrathin polymer films. In: Mechanics of Nanoscale Materials and Devices, edited by A. Misra, J.P. Sullivan, H. Huang, K. Lu, and S. Asif (Mater. Res. Soc. Symp. Proc., vol. 924E, Warrendale, PA, 2006), 0924-Z04-10.
  18. S.H. Im and R. Huang, Morphological instability and kinetics of an elastic film on a viscoelastic layer. Proceedings of IUTAM Symposium on Size Effects on Material and Structure Behavior at Micron- and Nano-Scales (Eds. Q.P. Sun and P. Tong, Hong Kong, 31 May - 4 June, 2004), Springer 2006, pp. 41-50.
  19. D.W. Gan, R. Huang, P.S. Ho, J. Leu, J. Maiz, T. Scherban, Effects of passivation layer on stress relaxation and mass transport in electroplated Cu films. Proceedings of the 7th International Workshop on Stress-Induced Phenomena in Metallization, Austin, Texas, 14-16 June 2004. AIP Conference Proceedings 741, 256-267 (2004).
  20. R. Huang, Z. Suo, Morphological instability of solid-on-liquid thin film structures. MRS Symposium Proceedings, vol. 749, 121-126 (2002).
  21. R. Huang, H. Yin, J. Liang, K. D. Hobart, J. C. Sturm, and Z. Suo, Relaxation of a strained elastic film on a viscous layer. MRS Symposium Proceedings, vol. 695, 115-120 (2001).
Book Chapters:
  1. R. Huang, A Kinetics Approach to Surface Wrinkling of Elastic Films, to appear as Chapter 5 in: Mechanical Self-Assembly: Science and Applications (Editor: X. Chen), Springer, 2013.
  2. Q. Lu and R. Huang, Mechanical Behavior of Monolayer Graphene by Continuum and Atomistic Modeling. Chapter 14 in: Simulations in Nanobiotechnology (Editor: K. Eom), CRC Press, 2011.
  3. X. Zhang, S. H. Im, R. Huang, P. S. Ho, Chip-Packaging Interaction and Reliability Impact on Cu/Low-k Interconnects. Chapter 2 in: Integrated Interconnect Technologies for 3D Nanoelectronic Systems (Editors: M. Bakir and J. Meindl), Artech House, Norwood, MA, 2008.