Interfacial adhesion plays a significant role in determining the overall reliability of many technologically important devices. For microelectronics, in particular, adhesion can determine the overall mechanical integrity of the structure especially when considering processes such as CMP. However, it is not only mechanical reliability that may be affected by the adhesive properties of interfaces but also the electrical robustness of the device in such processes as electromigration. This work reports on progress made at understanding how adhesion and overall device reliability are related.