Thin films subject to compressive stress are susceptible to buckle delamination wherein an initially debonded region of the film buckles away from the substrate supplying elastic energy to drive the interface delamination. This type of film failure is widely observed and generic to many film/substrate systems. The shapes of the propagating buckles takes a number of forms, including shapes that are circular, straight-sided and the intriguing telephone cord morphology. Recent observational work on the morphologies using atomic force microscopy and focussed ion beam slicing will be discussed along with some new theoretical simulations of the telephone cord blisters. The underlying mechanics explaining the relative frequency of the telephone cord morphology relative to other shapes will be presented. Experimental and theoretical results on the role of substrate curvature on the propagation of the blisters will also be presented. The work has been done in collaboration with A. G Evans, H. M. Jensen and M. Moon.