Mechanics of Thin Films and Other Small Structures

        Rui Huang
        Civil and Environmental Engineering Department and Princeton Materials Institute
        Princeton University, Princeton, NJ 08544
        Email: ruihuang@princeton.edu; Tel: 609-258-1619; Fax: 609-258-1270

Technical Program:

1. DEFORMATION, FRACTURE, AND MASS TRANSPORT A

        John Hutchinson, Harvard University
        MECHANICS OF PROPAGATING BUCKLE DELAMINATIONS

        Rob Ritchie, UC Berkeley
        A Mechanism for the Premature Failure of Cyclically-Loaded Polycrystalline Silicon Thin Structural Films

        Rui Huang, Princeton University
        Compressed Elastic Islands on a Viscous Layer: Expansion, Wrinkling, and Fracture

        Jianku Shang, University of Illinois at Urbana-Champaign
        In-situ TEM observations of cracking of interfacial films

        Robert McMeeking, UC Santa Barbara
        Models for the Nonlinear Switching of Ferroelectrics

2. MICROELECTRONICS, MEMS, AND COATING A

        Jun He, Intel
        Thermo-mechanical Challenges of Cu/Low k Interconnects

        Paul Ho, University of Texas at Austin
        Material and Reliability Issues of Cu/low k Damascene Interconnects

        Michael Lane, IBM
        Chemistry at Interfaces and Adhesion

        Xiaohu Liu, IBM
        Mechanics of stress voiding in thin films

        Robert Keller, NIST
        Current-induced fatigue in chip level interconnects

3. NANOSTRUCTURES AND NANOMECHANICS A

        Rachel Goldman, University of Michigan
        Semiconductor Nanostructures: Phase Separation, Self-Assembly, and 3D Quantum Dot Crystals

        Jim Liang, Princeton University
        Stable Islands by Height-Constrained Stranski-Krastanov and Lithographically-Induced Self-Assembly

        Cheng-hsin Chiu, National University of Singapore
        Formation of Nanocrystal Islands During Heteroepitaxial Growth

        Vivek Shenoy, Brown University
        A continuum description of the evolution of stepped surfaces in strained nanostructures

        Zhenyu Zhang and Kalman Varga, Oak Ridge National Lab
        Critical layer thickness in Stranski-Krastanow growth of Ge on Si(001)

4. DEFORMATION, FRACTURE, AND MASS TRANSPORT B

        Bill Nix, Stanford University
        Modeling Plasticity in Polycrystalline Gold Thin Films on Silicon Substrates

        Eric Stach, Lawrence Berkeley National Lab
        In-situ nanoindentation: a novel method for exploring thin film mechanical behavior

        Erik Van der Giessen, University of Groningen, The Netherlands
        Discrete dislocation plasticity for small scales

        Huajian Gao, Max-Planck Institute, Germany
        Crack-Like Grain Boundary Diffusion Wedges in Thin Films on Substrates

        Neville Moody, Sandia National Lab
        Interfacial Failure of Thin Epoxy Films

5. MICROELECTRONICS, MEMS, AND COATING B

        Ben Freund, Brown University
        Pull-in voltage of a MEMS microphone

        Mark Spearing, MIT
        The mechanics of thick deposited layers and their implications for practical MEMS

        Roberto Ballarini, Case Western Reserve University
        DESIGN OF MULTILAYERED POLYSILICON FOR MOEMS APPLICATIONS

        Kevin Hemker, Johns Hopkins University
        The mechanical behavior of LIGA Ni structures for MEMS applications

        Wole Soboyejo, Princeton University
        Plasticity in LIGA Nickel MEMS Structures: Size Effects and Dislocation Substructures

6. NANOSTRUCTURES AND NANOMECHANICS B

        Joanna Mirecki Millunchick, University of Michigan
        Strain-Induced Morphologies and Compositional Modulations in Compound Semiconductor Thin Films

        Wei Lu, University of Michigan
        Forces that drive nanoscale self-assembly on solid surface

        KJ Cho, Stanford University
        Modeling of Nanostructure Patterning

        Yong-Wei Zhang, Institute for Materials Research and Engineering, Singapore
        The in-plane and out-of-plane self-organization of heteroepitaxial islands in superlattices

        Long-Qing Chen, Penn State University
        A phase-field model for coherent microstructure evolution in a thin film constrained by a substrate

7. DEFORMATION, FRACTURE, AND MASS TRANSPORT C

        Frans Spaepen, Harvard University
        Mechanical properties of metallic and ceramic thin films

        Carl Thompson, MIT
        Stress and structure evolution during formation of polycrystalline thin films

        Joost Vlassak, Harvard University
        The mechanical properties of Electroplated Cu Thin Films

        Rick Vinci, Lehigh University
        Effects Of Microstructure And Solute Content In Pt Thin Films

        Narayanaswamy Sridhar, Rockwell Scientific
        Relaxation Kinetics of a Compressed Film on a Viscous Substrate

8. MICROELECTRONICS, MEMS, AND COATING C

        Daniel Mumm, Princeton University
        On the Mechanics of Thermally Grown Oxides and Thermal Barrier Coating Systems

        Eric Jordan, University of Connecticut
        Fracture Mechanics Applied to TBC failure, Experiments and Analysis

        Jack Beuth, Carnegie Mellon University
        Toughness Degradation in Thermal Barrier Coating Systems

        Ming-Wei Chen, Johns Hopkins University
        Phase transformation and transformation strain in thermally cycled platinum aluminide bond coats

        Zhigang Suo, Princeton University
        Coupled diffusion and creep in multiphase coatings

9. NANOSTRUCTURES AND NANOMECHANICS C

        Jacob Israelachvili, UC Santa Barbara
        COALESCENCE OF DUCTILE METAL SURFACES: WHEN SOLIDS CAN BEHAVE LIKE LIQUIDS AT THE NANO-SCALE

        Harriet Kung, DOE and Los Alamos National Lab
        Deformation and the Origins of Strength in Metallic Multilayers

        Mark Phillips, Stanford University
        Deformation behavior of high-strength nanoscale Al/Al₃Sc multilayers

        Peter Anderson, Ohio State University
        Computer Simulations and Experimental Observations of Dislocation Motion in Nanoscale Multilayer Films

        Taher Saif, University of Illinois at Urbana-Champaign
        Experimental results on freestanding nanoscale Al films

10. DEFORMATION, FRACTURE, AND MASS TRANSPORT D

        Bill Gerberich, University of Minnesota
        A volume to surface length scale for thin film mechanics

        Kyung-Suk Kim, Brown University
        Mechanical properties of nano-structured solid surface layers

        Ken Liechti, University of Texas at Austin
        INTERFACIAL FORCE MICROSCOPY STUDIES OF γ-APS ON GLASS AND SiO₂

        Nancy Sottos, University of Illinois at Urbana-Champaign
        Measurement of Mixed-Mode Interfacial Failure in Thin Films Using Laser Induced Stress Waves

        Xi Chen, Harvard University
        On the mechanics of foreign object damage

11. MICROELECTRONICS, MEMS, AND COATING D

        Ares Rosakis, CalTech
        CGS INTERFEROMETRY AS A FULL-FIELD, REAL-TIME, AND IN-SITU WAFER INSPECTION AND RELIABILITY TOOL

        Xiantao Yan, Lightcross, Inc.
        Cladding Layer Thickness Effect on Optical Performance in Ridged Waveguide

        Tianjian Lu, Cambridge University
        Optimal design of microclips for mounting of optical fibers in silicon V-shaped grooves

        Alex Volinsky, Motorola
        A Comparison Study of Ti/GaAs Ti/Si Fracture

        Shef Baker, Cornell University
        Effects of adhesion on deformation behavior of thin metal films on substrates

12. NANOSTRUCTURES AND NANOMECHANICS D

        Tongyi Zhang, Hong Kong University of Science and Technology
        Depth-dependent hardness

        Tsu-Wei Chou, University of Delaware
        An Atomistic Modeling of the Mechanical Behavior of Carbon Nanotubes

        Chongqing Ru, University of Alberta, Canada
        Surface wrinkling of two mutually attracting elastic bodies due to van der Waals-like interaction

        Mu Wang, Nanjing University, China
        Spontaneous Correlation of Crystallographic Orientations in Crystallite Aggregation (cancelled)

        Mark Walter, Ohio State University
        Characterization of Indentation Damage in Boron Carbide/DLC Nanocomposite Coatings

13. DEFORMATION, FRACTURE, AND MASS TRANSPORT E

        Wei Tong, Yale University
        Mechanical Properties and Stresses in Two Thin Film-Substrate Systems

        David Read, NIST
        Microtensile Testing in the Scanning Electron Microscope

        Krishna Garikipati, University of Michigan
        Theoretical treatment of void nucleation due to coupling of mechanics and vacancy composition

        Sven Strohband, Stanford University
        Multiscale Simulations of Interface Separation in Pre-Stressed Thin-Film Structures

        Nathan Klingbeil, Wright State University
        Critical Crack Lengths for Debond-Resistant Bimaterial Layers

14. MICROELECTRONICS, MEMS, AND COATING E

        Joris Proost, Harvard University
        IN-SITU STUDY OF THE GROWTH STRESS AND STIFFNESS OF ALUMINA THIN FILMS DURING VAPOR DEPOSITION

        Alberto Cuitino, Rutgers University
        Multiscale/multi-physics modeling of void evolution on narrow interconnect lines

        Lizhi Sun, The University of Iowa
        Dislocation activities in semiconductor thin film systems

        Daniel Balint, Harvard University
        Delamination of Wear-Resistant Coatings

        Vijay Gupta , UCLA
        Mechanical Properties of Nanostructured Silica Films (cancelled)