Devices in advanced technologies often have complex architectures, hybrid materials, and small features. Examples include integrated circuits, microelectromechanical systems (MEMS), and thermal barrier coatings. The mechanical behavior of such integrated structures often affects their fabrication and durability. By the very nature of integrated structures, the field is cross-disciplinary, involving many materials (metals, ceramics, polymers, semiconductors, etc.), and many modes of response (fracture, deformation, instability, and mass transport). The field is extremely active, both in terms of industrial applications and academic research.

Many people with advanced degrees in applied mechanics and mechanical behavior of materials are now finding jobs in the microelectronic industry and biomedical device industry. This Technical Committee serves as a home community for this group of people, and a link between applied mechanics and new, exciting applications. It will also provide a way for the AMD to interact with some of the Industrial Tracks.

This Technical Committee was established by the Executive Committee of the Applied Mechanics Division in November 2005.