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Rui Huang
Associate Professor
Pearlie Dashiell Henderson Centennial Fellowship in Engineering
Aerospace Engineering and Engineering Mechanics
University of Texas at Austin
Email: ruihuang@mail.utexas.edu
Phone: 1-512-471-7558
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| Brief Narrative |
Rui Huang received his Bachelor degree in Theoretical and Applied Mechanics from the University of Science and
Technology of China in 1994 and his PhD degree in Civil and Environmental Engineering,
with specialty in Mechanics, Materials, and Structures, from Princeton University in 2001.
He joined the University of Texas at Austin as an
Assistant Professor in September 2002 and was promoted to Associate Professor with tenure in 2008.
Dr. Huang's research interests are in the area of engineering mechanics with a particular emphasis on integrated
materials and
structures of small dimensions (from micro to nano scales). His research is motivated by practical applications in
microelectronics, photonics, micro-electromechanical systems (MEMS), and emerging nano/bio-technologies. The objective
of his research is to provide fundamental understandings of the mechanics in integrated material systems and to
establish a scientific base for design, fabrication, and testing of such systems.
| Education: |
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| Teaching: |
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| Research Interests: |
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Mechanics of integrated materials and structures at micro and nano scales
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Reliability of advanced interconnects and packaging for microelectronics
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Mechanical instability of thin films and nanostructures
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Computational mechanics, multiscale modeling and simulations
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| Selected Publications
(list all): |
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S. Gowrishankar, H. Mei, K.M. Liechti and R. Huang,
A comparison of direct and iterative methods for determining traction-separation relations.
Submitted, May 2012.
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T. Jiang, S.-K. Ryu, Q. Zhao, J. Im, R. Huang and P.S. Ho,
Measurement and Analysis of Thermal Stresses in 3D Integrated Structures Containing
Through-Silicon Vias. Submitted, April 2012.
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F. Weiss, S. Cai, Y. Hu, M. K. Kang, R. Huang, Z. Suo, Creases and wrinkles on the surface of a swollen gel.
Submitted, March 2012.
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T. Lu, J. Huang, C. Jordi, G. Kovacs, R. Huang, D.R. Clarke, Z. Suo, Dielectric elastomer actuators
under equi-biaxial forces, uniaxial forces, and uniaxial constraint of stiff fibers.
Soft Matter, accepted, April 2012.
DOI: 10.1039/c2sm25692d.
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N. Bouklas and R. Huang, Swelling kinetics of polymer gels: comparison of linear and nonlinear theories.
Soft Matter, accepted for publication, March 2012.
DOI: 10.1039/C2SM25467K.
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C. Guo, V. Nayyar, Z. Zhang, Y. Chen, J. Miao, R. Huang and Q. Liu,
Path-guided wrinkling of nanoscale metal films. Advanced Materials, accepted for publication, March 2012.
DOI: 10.1002/adma.201200540.
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S.-K. Ryu, K.-H. Lu, T. Jiang, J. Im, R. Huang, P.S. Ho,
Effect of Thermal Stresses on Carrier Mobility and Keep-out Zone around Through-Silicon Vias for 3-D Integration.
IEEE Trans. on Device and Materials Reliability, accepted for publication, March 2012.
DOI: 10.1109/TDMR.2012.2194784.
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S.-K. Ryu, Q. Zhao, M. Hecker, H. Y. Son, K. Y. Byun, J. Im, P.S. Ho, and R. Huang,
Micro-Raman Spectroscopy and Analysis of Near-Surface Stresses in Silicon around
Through-Silicon Vias for Three-Dimensional Interconnects.
J. Appl. Phys. 111, 063513 (2012).
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W. Gao and R. Huang,
Effect of surface roughness on adhesion of graphene membranes.
J. Phys. D: Appl. Phys. 44, 452001 (2011).
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R. Huang and Z. Suo,
Electromechanical phase transition in dielectric elastomers.
Proc. Royal Soc. A 468, 1014-1040 (2012).
DOI: 10.1098/rspa.2011.0452.
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V. Nayyar, K. Ravi-Chandar, R. Huang,
Stretch-induced stress patterns and wrinkles in hyperelastic thin sheets.
International Journal of Solids and Structures 48, 3471-3483 (2011).
DOI: 10.1016/j.ijsolstr.2011.09.004.
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H. Mei, C.M. Landis, R. Huang,
Concomitant wrinkling and buckle-delamination of elastic thin films on compliant substrates.
Mechanics of Materials 43, 627-642 (2011).
DOI: 10.1016/j.mechmat.2011.08.003.
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M.K. Kang and R. Huang, Swell induced surface instability
of confined hydrogel layers on substrates.
J. Mech. Phys. Solids 58, 1582-1598 (2010).
DOI: 10.1016/j.jmps.2010.07.008.
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Q. Lu, M. Arroyo, R. Huang, Elastic bending modulus of monolayer graphene.
J. Phys. D: Appl. Phys. 42, 102002 (2009). Posted online at arXiv:0901.4370v1.
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Q. Lu and R. Huang, Nonlinear mechanics of single-atomic-layer
graphene sheets. Int. J. Applied Mechanics 1, 443-467 (2009).
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S. H. Im and R. Huang,
Wrinkle Patterns of Anisotropic Crystal Films on Viscoelastic Substrates.
J. Mech. Phys. Solids 56, 3315-3330 (2008).
doi: 10.1016/j.jmps.2008.09.011.
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B. Li, M. K. Kang, K. Lu, R. Huang, P. S. Ho, R. A. Allen, and
M. W. Cresswell,
Fabrication and Characterization of Patterned Single-Crystal Silicon Nanolines.
Nano Letters 8, 92 -98 (2008).
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H. Mei, J.Y. Chung, H.-H. Yu, C.M. Stafford, and R. Huang,
Buckling modes of elastic thin films on elastic substrates.
Applied Physics Letters 90, 151902 (2007).
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R. Huang and S.H. Im,
Dynamics of wrinkle growth and coarsening in stressed thin films.
Physical Review E 74, 026214 (2006).
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Y. Pang and R. Huang,
Nonlinear effect of stress and wetting on surface evolution in epitaxial thin films.
Physical Review B 74, 075413 (2006).
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C.M. Stafford, B.D. Vogt, C. Harrison, D. Julthongpiput, R. Huang,
Elastic Moduli of Ultrathin Amorphous Polymer Films. Macromolecules 39, 5095-5099 (2006).
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R. Huang, Electrically induced surface instability of a conductive thin film
on a dielectric substrate. Applied Physics Letters 87, 151911 (2005).
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R. Huang, Kinetic wrinkling of an elastic film on a viscoelastic substrate.
Journal of the Mechanics and Physics of Solids 53, 63-89 (2005).
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| Recent Invited Talks: |
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Mechanics of Thin Films: Wrinkling, Delamination and Fracture,
Corning Inc., Corning NY. January 27, 2012.
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Thermomechanical Reliability of Through-Silicon Vias for 3D Interconnects, ASME 2011 Pacific Rim Technical
Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS
(InterPACK 2011), Portland, Oregon. July 6, 2011.
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Surface Instability of Materials Mediated by Transport Kinetics,
International Conference on Materials for Advanced Technologies, Singapore. June 28, 2011.
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Wrinkling of Thin Films and Surface Instability of Hydrogels,
Beijing Jiaotong University, Beijing, China. June 15, 2011.
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Wrinkling of Thin Films and Surface Instability of Hydrogels,
Institute of High Performance Computing, Singapore. March 16, 2011.
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Graphene: Continuum Mechanics and Atomistic Modeling,
Institute of High Performance Computing, Singapore. March 14, 2011.
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Swell Induced Surface Instability in Substrate-Confined Hydrogel Layers,
Materials Research Society Fall Meeting, Boston, MA. November 29, 2010.
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Continuum Mechanics and Atomistic Modeling of Graphene,
Department of Mechanical Engineering, Columbia University, New York, NY. November 5, 2010.
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Continuum Mechanics and Atomistic Modeling of Graphene, Department of Mechanical and Industrial Engineering,
Northeastern University, Boston, MA. October 29, 2010.
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Nonlinear Mechanics of Graphene Nanoribbons, Materials Sceince and Technology Conference, Houston, TX. October 20, 2010.
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Modeling and Simulations of Interfacial Delamination, Intel Corp., Chandler, AZ, August 10, 2010.
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Characterization and Cohesive Interface Modeling of Delamination in Chip-Package Systems,
Advanced Micro Devices (AMD), Austin, TX, June 11, 2010.
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Thermomechanical Reliability Challenges for 3D Interconnects with Through-Silicon Vias,
the 11th International Workshop
on Stress-Induced Phenomena in Metallization, Dresden, Germany, April 14, 2010.
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Nonlinear Mechanics of Graphene Monolayer, Texas A&M University, November 19, 2009.
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Fracture of Brittle Thin Films on Compliant Substrates,
12th International Conference on Fracture, Ottawa, Canada, July 16, 2009.
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Stress Analyses and Mechanical Reliability of 3D Interconnects with Through-Silicon Vias, International Workshop
on 3D Design and Nanoelectronic System Technologies, Georgia Institute of Technology, Atlanta, GA, June 15, 2009.
- Impact of Chip-Package Interactions on Mechanical Reliability of Advanced Interconnects, MRS Spring Meeting,
San Francisco, April 15, 2009.
- Nonlinear Dynamics of Wrinkle Growth and Pattern Formation in Stressed
Elastic Thin Films,
APS March Meeting, Pittsburgh, March 18, 2009.
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| Other Activities: |
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Symposium on Mechanics of Integrated Materials and Structures
in Advanced Technologies at the
2008 ASME International Mechanical Engineering Congress,
to be held from October 31 to November 6, 2008, in Boston, Massachusetts.
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Symposium on Mechanical Instabilities in Polymer Films,
Interfaces and Nanostructures at the
Spring 2008 ACS National Meeting and Exposition, to be held at New Orleans, Louisiana,
from Sunday, April 6 to Thursday, April 10, 2008.
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Symposium on Mechanics of Integrated Structures and Materials
in Advanced Technology at the
2007 ASME Applied Mechanics and Materials Conference (McMat 2007),
to be held on June 3-7, 2007, at the University of Texas at Austin.
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The Mindlin Centennial Symposium,
as a part of
the 15th US National Congress on Theoretical
and Applid Mechanics at University of Colorado at Boulder, 25-30 June 2006.
Click here
for a biographical sketch of R.D. Mindlin.
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Thin Films and Small Scale Mechanical Behavior,
a mini-symposium at
the 8th US National Congress on Computational Mechanics (24-28 July 2005, Austin, Texas)
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Mechanics of Thin Films and Other Small Structures,
a special symposium of
the 14th US Congress of Theoretical and Applied Mechanics (23-28 June 2002, Virginia Tech)
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